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silicon-disulfide

VD0824 Silicon Disulfide Evaporation Materials, SiS2

Catalog No.VD0824
MaterialSilicon Sulfide (SiS2)
Purity99.5% ~ 99.9%
ShapePowder/ Granule/ Custom-made

TFM stands out as a top-tier manufacturer and supplier of high-purity silicon disulfide evaporation materials. We provide a diverse range of evaporation materials, available in both powder and granule forms to suit various applications. Additionally, we offer customized forms tailored to your specific needs, ensuring that you receive the precise material required for your projects.

MSDS File

Silicon Disulfide Evaporation Materials Overview

TFM offers high-quality silicon disulfide evaporation materials, characterized by their chemical formula SiS₂. This sulfide ceramic material is crucial for achieving high-quality deposited films in various deposition processes. With a commitment to quality, TFM provides silicon disulfide materials with purity levels reaching up to 99.9995%, ensuring consistent and reliable performance.

Silicon Disulfide Evaporation Materials Specification

Material TypeSilicon Disulfide
SymbolSiS2
Appearance/ColorWhite Solid
Melting Point1,090 °C (1,990 °F; 1,360 K) sublimes
Density1.853 g/cm3
Purity99.5% ~ 99.9%
ShapePowder/ Granule/ Custom-made

Applications

Silicon disulfide evaporation materials are integral to several deposition processes, including:

  • Semiconductor Deposition
  • Chemical Vapor Deposition (CVD)
  • Physical Vapor Deposition (PVD)

They are predominantly used in optics for:

  • Wear Protection
  • Decorative Coatings
  • Displays

Packaging and Handling

Our silicon disulfide evaporation materials are carefully packaged and clearly labeled to ensure proper identification and quality control. We take extensive precautions to prevent any damage during storage and transportation, guaranteeing the integrity of the material upon delivery.

Contact Us

For inquiries regarding high-purity silicon disulfide evaporation materials, including various shapes such as tablets, granules, rods, and wires, please reach out to TFM. We also offer customized forms and quantities tailored to your requirements. Additionally, TFM provides a range of evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. Contact us for current pricing and further details.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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