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VD0725 Silicon Monoxide Evaporation Materials, SiO

Material Type: Silicon (II) Oxide
Symbol: SiO
Purity: 99.9% ~ 99.99%
Shape: Powder/ Granule/ Custom-made

TFM stands out as a top-tier manufacturer and supplier specializing in high-purity silicon monoxide evaporation materials. Our extensive range includes both powder and granule forms, and we also offer customized solutions tailored to meet specific needs. Whether you require standard options or bespoke formulations, TFM is equipped to deliver quality and precision in every product.

MSDS File

Silicon Monoxide Evaporation Materials Overview

Silicon monoxide (SiO) evaporation materials from TFM are vital for producing high-quality deposited films. With a chemical formula of SiO, these materials are essential in various deposition processes. TFM is committed to delivering evaporation materials with exceptional purity, up to 99.9995%, supported by rigorous quality assurance practices to ensure reliability.

Specifications

Material TypeSilicon Monoxide
SymbolSiO
Color/AppearanceBrown-black Glassy Solid
Melting Point1,702 °C
Theoretical Density 2.13 g/cm3
Purity99.9% ~ 99.95%
ShapePowder/ Pellets/ Granule/ Custom-made

Applications

Silicon monoxide evaporation materials are used in a variety of applications, including:

  • Deposition Processes: Critical for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Suitable for wear protection, decorative coatings, and display technologies.

Packaging

Our silicon monoxide evaporation materials are carefully tagged and labeled for precise identification and quality control. We ensure that the materials are protected from damage during storage and transportation.

Contact Us

TFM is a leading provider of high-purity silicon monoxide evaporation materials. We offer products in various forms, including tablets, granules, rods, and wires, with customization options available. In addition, we supply evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing or inquiries about materials not listed, please contact us.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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