Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors
silicon-silver-sputtering-target-si-ag-removebg-preview-1

ST0989 Silicon Silver Sputtering Target, Si-Ag

Chemical FormulaSi-Ag
Catalog No.ST0989
CAS Number–
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Leveraging our deep expertise in materials science, TFM provides Silicon Silver Sputtering Targets with unmatched purity. We are committed to offering competitive pricing and customized solutions designed to meet the precise demands of nanotechnology and thin-film deposition applications.

MSDS File

Silicon Silver Sputtering Target Description

The Silicon Silver Sputtering Target is distinguished by several key properties that make it essential for advanced material production. Its high purity ensures that the sputtering process yields thin films with minimal impurities and defects, enhancing material quality. The target’s excellent electrical conductivity facilitates efficient current transfer, boosting sputtering efficiency while its thermal stability ensures consistent performance even under high-energy sputtering conditions. Additionally, the target maintains robust physical and chemical stability, preserving its structure and composition in demanding environments. These attributes make Silicon Silver Sputtering Targets particularly suitable for high-precision applications, including thin film deposition and nanofabrication.

Related Product: Aluminum Silicon Sputtering Target, Silicon Carbide Sputtering Target

Silicon Silver Sputtering Target Specifications

Compound FormulaSi-Ag
AppearanceSilver Metallic Target
Melting Point837℃
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Silicon Silver Sputtering Target Handling Notes

Indium bonding is recommended for Silicon Silver Sputtering Targets due to their inherent properties that can pose challenges during sputtering. Silicon Silver Sputtering Targets are characterized by low thermal conductivity and brittleness, making them susceptible to thermal shock and potential damage under high-energy conditions. Indium bonding provides a more stable and reliable attachment, mitigating these issues by improving thermal management and reducing the risk of target failure during the sputtering process. This bonding method helps maintain the target’s performance and longevity, ensuring consistent and effective operation.

Silicon Silver Sputtering Target Application

1. Sensor Manufacturing:
Silicon Silver Sputtering Targets are essential in producing high-performance sensors, including gas and humidity sensors. By sputtering silicon and silver films, these targets enable the creation of sensors with enhanced sensitivity and stability, making them suitable for a variety of detection and measurement applications.

2. Microelectronic Packaging:
In microelectronic packaging, Silicon Silver Sputtering Targets are used to deposit conductive films that establish connections between semiconductor chips and external circuits. This process enhances the reliability and performance of electronic devices, ensuring effective communication and durability in complex electronic systems.

3. Surface Modification:
These sputtering targets are employed to modify surface properties of materials. By applying silicon and silver films through sputtering, the surface characteristics of materials can be improved, such as increased corrosion resistance and enhanced wear resistance, extending the lifespan and functionality of components.

4. Biomedical Applications:
Silicon Silver Sputtering Targets also find use in biomedical fields. They are utilized in the creation of biosensors and drug carriers, contributing to advancements in medical diagnostics and therapeutic delivery systems. The unique properties of silicon and silver support the development of innovative solutions for various biomedical applications.

Silicon Silver Sputtering Target Packaging

We ensure that our Silicon Silver Sputtering Targets are meticulously managed during both storage and transportation to maintain their quality and integrity in their original state.

Get Contact

Our Silicon Silver Sputtering Targets are offered in a range of forms, purities, and sizes to meet diverse application needs. We focus on delivering high-purity physical vapor deposition (PVD) materials, ensuring optimal density and minimal average grain sizes. These targets are designed for use in semiconductor, chemical vapor deposition (CVD), and physical vapor deposition (PVD) applications, including display and optical technologies.

Reviews

There are no reviews yet.

Be the first to review “ST0989 Silicon Silver Sputtering Target, Si-Ag”

Your email address will not be published. Required fields are marked *

Related Products

Related products

FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
Shopping Cart
Scroll to Top