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VD0788 Sodium Aluminum Fluoride Evaporation Materials, Na5Al3F14

Catalog No.VD0788
MaterialSodium Aluminum Fluoride (Na5Al3F14)
Purity99.9% ~ 99.95%
ShapePowder/ Granule/ Custom-made

TFM is a top-tier producer and supplier of high-purity Sodium Aluminum Fluoride (Na5Al3F14) evaporation materials, along with a wide range of other evaporation materials. We provide these materials in both powder and granule form, with custom shapes and specifications available to meet unique project needs.

Sodium Aluminum Fluoride Evaporation Materials Overview

TFM offers premium sodium aluminum fluoride evaporation materials, which are ceramic-based and have the chemical formula Na5Al3F14. These high-purity materials are essential in deposition processes to achieve optimal film quality. TFM specializes in producing sodium aluminum fluoride evaporation materials with purity levels up to 99.9995%, ensuring reliable performance through rigorous quality control procedures.

Related Products:

  • Aluminum Evaporation Materials
  • Fluoride Ceramic Evaporation Materials

Sodium Aluminum Fluoride Evaporation Materials Specifications

Material TypeSodium Aluminum Fluoride
Chemical SymbolNa5Al3F14
Appearance/ColorWhite solid
Melting Point1291°C
Density2.95 g/cm³
Purity99.9% ~ 99.95%
Available ShapesPowder/Granule/Custom-made

Applications of Sodium Aluminum Fluoride Evaporation Materials

Sodium aluminum fluoride is widely used in various deposition processes such as semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD). It is especially effective in optical applications, wear-resistant coatings, decorative layers, and display technology.

Packaging Information

TFM takes extra precautions to ensure that all sodium aluminum fluoride evaporation materials are properly labeled for easy identification and subjected to stringent quality control. Packaging is designed to prevent damage during transport and storage, ensuring that materials arrive in optimal condition.

Contact Us

TFM is a trusted supplier of high-purity sodium aluminum fluoride evaporation materials, available in various forms like tablets, granules, rods, and wires. We also offer custom forms to meet specific project needs. Additionally, TFM provides a range of complementary products, including evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. Feel free to contact us for pricing information or inquiries regarding any products not listed.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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