Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors
fluoride-targets-removebg-preview-2

ST0249 Sodium Aluminum Fluoride Sputtering Target, Na5Al3F14

Chemical Formula: Na5Al3F14
Catalog Number: ST0249
CAS Number: 13775-53-6
Purity: 99.9%, 99.95%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Sodium Aluminum Fluoride sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Sodium Aluminum Fluoride Sputtering Target Description

Sodium

Sodium, designated by the symbol “Na,” is a chemical element derived from the English word ‘soda’ (or ‘natrium’ in Latin). It was first identified in 1807 by H. Davy, who also accomplished its isolation. Sodium is positioned as the 11th element on the periodic table, located in Period 3 and Group 1 within the s-block. The atomic mass of sodium is precisely 22.98976928(2) Dalton, with the numbers in parentheses indicating the level of uncertainty associated with this measurement.

AluminiumAluminium, also known as aluminum, is a chemical element with the symbol “Al.” Derived from the Latin name for alum, ‘alumen’, which means bitter salt, it was first identified in 1825 by H.C. Ørsted, who also achieved its isolation. Aluminium is positioned as element number 13 on the periodic table, located in Period 3 and Group 13 within the p-block. The atomic mass of aluminium is 26.9815386(8) Dalton, with the numbers in parentheses reflecting the uncertainty of this measurement.

Fluorine

Fluorine, also referred to as fluorin, is a chemical element that originated from the Latin word ‘fluere’, meaning to flow. It was first identified in 1810 by A.-M. Ampère and later isolated by H. Moissan, who also announced this achievement. The symbol for fluorine on the periodic table is “F”. It has an atomic number of 9, is located in Period 2 and Group 17, and belongs to the p-block. The relative atomic mass of fluorine is 18.9984032(5) Dalton, with the number in brackets indicating the measurement’s uncertainty.

Sodium Aluminum Fluoride Sputtering Target Application

The Sodium Aluminum Fluoride Sputtering Target is employed across a broad spectrum of industrial applications. It is essential for thin film deposition processes and is used in decoration, semiconductor manufacturing, display production, LED creation, and photovoltaic device development. Additionally, it is instrumental in producing functional coatings used in the optical information storage industry. This target also finds applications in the glass coating industry, which includes coatings for automotive and architectural glass, as well as in optical communication sectors.

Sodium Aluminum Fluoride Sputtering Target Packing

Our Sodium Aluminum Fluoride Sputter Targets are meticulously tagged and labeled externally to facilitate efficient identification and maintain strict quality control standards. We take extensive precautions to shield these targets from any potential damage that could occur during storage or transportation, ensuring they arrive in optimal condition.

Get Contact

TFM offers Sodium Aluminum Fluoride Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

Reviews

There are no reviews yet.

Be the first to review “ST0249 Sodium Aluminum Fluoride Sputtering Target, Na5Al3F14”

Your email address will not be published. Required fields are marked *

Related Products

Related products

FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
Shopping Cart
Scroll to Top