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ST0250 Sodium Fluoride Sputtering Target, NaF

Chemical Formula: NaF
Catalog Number: ST0250
CAS Number: 7681-49-4
Purity: 99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Sodium Fluoride sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Sodium Fluoride Sputtering Target Description

The Sodium Fluoride Sputtering Target is a fluoride ceramic sputtering target composed of the elements sodium and fluorine. This target is specifically designed for use in various thin film deposition processes.

SodiumSodium, with the chemical symbol “Na,” is derived from the English word ‘soda’ and the Latin ‘natrium’. It was first identified by H. Davy in 1807, who also succeeded in isolating it. Sodium is the 11th element on the periodic table, located in Period 3 and Group 1, belonging to the s-block. Its relative atomic mass is 22.98976928(2) Dalton, with the number in parentheses representing the measurement’s uncertainty.

Fluorine

Fluorine, also known as fluorin, is a chemical element whose name originates from the Latin word ‘fluere’, meaning to flow. It was first mentioned by A.-M. Ampère in 1810 and was later isolated by H. Moissan, who announced the accomplishment. The symbol for fluorine is “F,” and it is the 9th element in the periodic table, positioned in Period 2 and Group 17, within the p-block. The relative atomic mass of fluorine is 18.9984032(5) Dalton, with the bracketed number indicating the uncertainty in this measurement.

Sodium Fluoride Sputtering Target Application

The Sodium Fluoride Sputtering Target is utilized in various industries for thin film deposition. It is commonly used in decorative applications, semiconductor manufacturing, displays, LEDs, and photovoltaic devices. Additionally, this target is essential for creating functional coatings and is employed in the optical information storage industry. It also finds applications in the glass coating industry, including automotive and architectural glass, as well as in optical communication technologies.

Sodium Fluoride Sputtering Target Packing

Our Sodium Fluoride Sputter Targets are carefully tagged and labeled on the outside to ensure clear identification and maintain strict quality control. We take considerable precautions to protect these targets from any damage that could occur during storage or transportation, ensuring they arrive in pristine condition.

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TFM offers Sodium Fluoride Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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