Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors

ST0047A Strontium Aluminate doped with Europium Sputtering Targets (SrAl2O4 with 3 wt% Eu )

MSDS File
Material TypeStrontium Aluminate doped with Europium
SymbolSrAl2O4 with 3 wt% Eu
Color/AppearanceVarious colors, Solid
Melting Point (°C)N/A
Theoretical Density (g/cc)N/A
Water SolubilityInsoluble
SputterRF, RF-R, DC
Type of BondIndium, Elastomer

Strontium Aluminate Doped with Europium Sputtering Targets

TFM offers Strontium Aluminate Doped with Europium (SrAl₂O₄:Eu³⁺) sputtering targets, which are designed for high-quality thin-film deposition in various advanced applications. The incorporation of Europium (Eu³⁺) in Strontium Aluminate enhances its luminescent properties, making it ideal for phosphorescent, electroluminescent, and optical applications.

These sputtering targets are widely used in the production of luminescent materials for displays, lighting devices, and electronic components that require high-performance phosphorescence and optical emission. The Europium-doped formulation significantly improves the brightness and stability of films, which is essential for both commercial and industrial applications.

Key Features and Advantages

  • High Luminescent Efficiency – Europium-doped Strontium Aluminate offers exceptional luminescence and afterglow properties, making it a preferred material for phosphorescent films and lighting devices.

  • High Purity – TFM provides Strontium Aluminate Doped with Europium sputtering targets with 99.9% purity, ensuring the deposition of thin films with superior quality and consistent performance.

  • Enhanced Optical Properties – The Europium doping enhances the optical emission and luminescent characteristics of the material, making it suitable for electroluminescent devices, displays, and lighting.

  • Customizable Sizes – Available in various sizes to meet both research and production needs, from small-scale experimental setups to large-scale manufacturing.

  • Stable Performance – These targets offer stable performance in thin-film deposition processes, ensuring high-density films with uniformity across a range of applications.

Specifications

  • Purity: 99.9%

  • Target Types Available:

    • Circular Targets: Diameter ≤ 14 inches, Thickness ≥ 1mm

    • Block Targets: Length ≤ 32 inches, Width ≤ 12 inches, Thickness ≥ 1mm

Applications

  • Phosphorescent Materials – Used in the creation of glow-in-the-dark materials for safety signs, emergency lighting, and novelty products.

  • Display Technologies – Ideal for flat panel displays, LED lighting, and electroluminescent devices requiring enhanced optical emissions and brightness.

  • Optical Emission – Utilized in the production of optical sensors, laser devices, and phosphor coatings in the telecommunication and entertainment industries.

  • Lighting Devices – These sputtering targets are widely used for the production of energy-efficient and long-lasting lighting solutions such as LED lights and signage.

Manufacturing Process

  • Cold Pressing & Sintering – The manufacturing process ensures high density and optimal performance in thin-film deposition applications.

  • Elastomer Bonding – Targets are bonded to a backing plate to improve film deposition uniformity and handling.

  • Cleaning & Packaging – Each target undergoes a thorough cleaning process and is carefully packaged to ensure it is free of contaminants and ready for vacuum deposition processes.

Options

  • Custom Sizes – Available in a range of sizes to suit different application requirements, from small-scale research to large-scale industrial production.

  • Research and Development – Smaller sizes are available for R&D, enabling experimental testing and prototype development.

  • Sputtering Target Bonding Service – TFM offers target bonding services to improve target performance, ensuring better sputtering efficiency and film quality.

Industry Impact

Strontium Aluminate Doped with Europium Sputtering Targets are pivotal in the development of advanced lighting, phosphorescent materials, and optical devices. With superior luminescent properties, these targets play a critical role in the production of high-efficiency displays, LED lighting, and energy-efficient optical products. TFM’s high-purity targets ensure consistent performance and high-quality thin films for next-generation electronics and illumination systems.

Reviews

There are no reviews yet.

Be the first to review “ST0047A Strontium Aluminate doped with Europium Sputtering Targets (SrAl2O4 with 3 wt% Eu )”

Your email address will not be published. Required fields are marked *

Related Products

Related products

FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
Shopping Cart
Scroll to Top