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ST0047C Strontium Bismuth Tantalate Sputtering Targets (SBT (Sr0.8Bi2.2Ta2O9))

MSDS File
Material TypeStrontium Bismuth Tantalate
SymbolSBT (Sr0.8Bi2.2Ta2O9)
Color/Appearance
Melting Point (°C)

Strontium Bismuth Tantalate Sputtering Targets

TFM offers Strontium Bismuth Tantalate (SrBi₂Ta₂O₉) Sputtering Targets, designed for thin-film deposition applications in advanced industries. These targets are known for their unique ferroelectric and piezoelectric properties, making them ideal for use in memory devices, capacitors, and sensor applications. With their high performance, Strontium Bismuth Tantalate sputtering targets are extensively used in electronic, optical, and energy storage applications.

Key Features and Advantages

  • High Purity – TFM’s Strontium Bismuth Tantalate sputtering targets are available in 99.9% purity, ensuring the deposition of high-quality films with consistent material properties.

  • Ferroelectric Properties – Known for their ferroelectric behavior, these targets are commonly used in non-volatile memory, piezoelectric devices, and optical coatings.

  • Excellent Thin Film Deposition Performance – Provides high-quality thin films used in advanced applications such as ferroelectric memories, multilayer capacitors, and smart sensors.

  • Customizable Sizes – Available in custom sizes to meet specific application needs, from research to large-scale production.

  • Stable and Durable – Manufactured using cold pressing and sintering techniques, ensuring high-density targets and reliable performance during deposition.

Specifications

  • Purity: 99.9%

  • Target Types Available:

    • Circular Targets: Diameter ≤ 14 inches, Thickness ≥ 1mm

    • Block Targets: Length ≤ 32 inches, Width ≤ 12 inches, Thickness ≥ 1mm

Applications

  • Ferroelectric Memory Devices – Strontium Bismuth Tantalate is used in non-volatile memory devices and random access memory (RAM) due to its ferroelectric properties.

  • Piezoelectric Devices – Applied in the manufacturing of sensors, actuators, and energy harvesters for automotive, medical, and industrial applications.

  • Optical Coatings – Used for antireflection coatings, optical filters, and thin-film mirrors in laser and display technologies.

  • Capacitors – Utilized in multilayer ceramic capacitors (MLCCs) for advanced electronic and telecommunication devices.

Manufacturing Process

  • Cold Pressing & Sintering – Ensures that the sputtering targets have high density and optimal performance for thin-film deposition.

  • Elastomer Bonding – The targets are bonded to a backing plate to improve deposition uniformity and handling during sputtering.

  • Cleaning & Packaging – Thoroughly cleaned and packaged to avoid contamination and ensure that the targets are ready for use in vacuum environments.

Options

  • Custom Sizes – Custom dimensions available to meet the specific needs of your application.

  • R&D Sizes – Smaller sizes are available for research and development, offering flexibility for experimental and prototype work.

  • Sputtering Target Bonding Service – For improved performance and long-lasting thin films, a target bonding service is available to enhance sputtering efficiency.

Industry Impact

TFM’s Strontium Bismuth Tantalate Sputtering Targets are essential materials for industries requiring high-performance thin films, such as electronics, energy storage, sensor technologies, and optical coatings. With high purity, excellent ferroelectric and piezoelectric properties, and customizable sizes, these targets enable the fabrication of cutting-edge devices in areas such as ferroelectric memories, actuators, capacitors, and optical sensors.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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