Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors

ST0991 Strontium Iron Oxide Sputtering Target, SrFe12O19

Chemical FormulaSrFe12O19
Catalog No.ST0991
CAS Number
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

TFM’s Strontium Iron Oxide Sputtering Targets combine superior quality with competitive pricing. Our Strontium Iron Oxide Sputtering Targets, available in the highest purity and various sizes, are the ideal raw materials for your research and production needs.

Introduction

Strontium Iron Oxide (SrFe₁₂O₁₉) Sputtering Targets are advanced ceramic targets used for the deposition of magnetic oxide thin films in electronics, spintronic devices, and microwave technologies. SrFe₁₂O₁₉, commonly known as Strontium Hexaferrite, is a ferrimagnetic material with excellent magnetic anisotropy, high coercivity, and strong chemical stability.

Because of these properties, SrFe₁₂O₁₉ sputtering targets are widely used in magnetron sputtering systems to produce thin films for magnetic storage, microwave devices, magnetic sensors, and research in advanced oxide electronics.

Detailed Description

Strontium Iron Oxide (SrFe₁₂O₁₉) is a ferrite compound belonging to the hexagonal magnetoplumbite crystal structure family. This structure provides strong magnetic anisotropy and high coercive force, making the material highly suitable for permanent magnet and magnetic thin film applications.

When used as a sputtering target, SrFe₁₂O₁₉ enables the deposition of magnetic oxide thin films with controlled composition and magnetic properties. The thin films produced from this target can exhibit strong perpendicular magnetic anisotropy, which is particularly useful for magnetic recording and microwave device applications.

SrFe₁₂O₁₉ sputtering targets are typically produced through advanced ceramic processing methods. High-purity precursor powders are carefully mixed and reacted through solid-state synthesis, followed by pressing and high-temperature sintering to form dense ceramic targets. The resulting targets exhibit high density, uniform microstructure, and stable sputtering behavior.

Maintaining high density is essential for sputtering targets because it ensures stable erosion during deposition and minimizes particle generation. Uniform composition is also critical for producing thin films with consistent magnetic properties.

Depending on deposition requirements, SrFe₁₂O₁₉ sputtering targets may be used in RF magnetron sputtering systems, which are commonly employed for oxide ceramic materials. Optional backing plates—such as copper backing plates—can be bonded to the target to improve heat dissipation and mechanical stability during high-power sputtering operations.

The deposited SrFe₁₂O₁₉ thin films are valued for their strong magnetic performance, thermal stability, and resistance to corrosion, making them suitable for demanding electronic and magnetic device applications.

Applications

Strontium Iron Oxide sputtering targets are widely used in advanced magnetic and electronic applications, including:

  • Magnetic thin films for microwave and RF devices

  • Magnetic recording media research

  • Spintronic devices and magnetic sensors

  • Ferrite-based microwave components

  • Magneto-optical materials and devices

  • Advanced oxide electronics research

These applications make SrFe₁₂O₁₉ an important material in modern magnetic thin film technologies.

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% – 99.99%Ensures consistent magnetic and structural properties
CompositionSrFe₁₂O₁₉ (Strontium Hexaferrite)Maintains correct magnetic phase
Density≥ 95% theoretical densityEnsures stable sputtering performance
Diameter25 – 200 mm (custom available)Compatible with sputtering systems
Thickness3 – 6 mmInfluences sputtering lifetime
BondingCopper backing plate optionalImproves heat dissipation during sputtering

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Strontium Iron Oxide (SrFe₁₂O₁₉)High coercivity and magnetic anisotropyMagnetic thin films and microwave devices
Barium Ferrite (BaFe₁₂O₁₉)Strong magnetic propertiesMagnetic storage media
Iron Oxide (Fe₃O₄)Good magnetic conductivityMagnetic sensors
Yttrium Iron Garnet (YIG)Excellent microwave magnetic propertiesMicrowave and spintronic devices

FAQ

QuestionAnswer
What sputtering method is suitable for SrFe₁₂O₁₉ targets?RF magnetron sputtering is typically used because SrFe₁₂O₁₉ is a ceramic oxide material.
Can SrFe₁₂O₁₉ sputtering targets be customized?Yes, target diameter, thickness, density, and bonding options can be customized.
What substrates are commonly used for SrFe₁₂O₁₉ thin films?Common substrates include sapphire, MgO, SrTiO₃, and silicon wafers.
What makes SrFe₁₂O₁₉ suitable for magnetic thin films?Its hexagonal crystal structure provides high coercivity and strong magnetic anisotropy.
Are bonded targets available?Yes, targets can be bonded to copper backing plates for improved thermal management during sputtering.

Packaging

Our Strontium Iron Oxide Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and maintain high standards of quality control. We take great care to prevent any potential damage during storage and transportation, ensuring the targets arrive in perfect condition.

Conclusion

Strontium Iron Oxide (SrFe₁₂O₁₉) sputtering targets provide an effective material solution for producing magnetic oxide thin films with high coercivity, strong anisotropy, and excellent thermal stability. These properties make them highly valuable for microwave devices, magnetic sensors, and advanced spintronic research.

With customizable sizes, high-purity ceramic composition, and optional backing plate configurations, SrFe₁₂O₁₉ sputtering targets support both advanced research and industrial thin film deposition systems.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

Reviews

There are no reviews yet.

Be the first to review “ST0991 Strontium Iron Oxide Sputtering Target, SrFe12O19”

Your email address will not be published. Required fields are marked *

Related Products

FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
Shopping Cart
Scroll to Top