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ST0991 Strontium Iron Oxide Sputtering Target, SrFe12O19

Chemical FormulaSrFe12O19
Catalog No.ST0991
CAS Number–
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

TFM’s Strontium Iron Oxide Sputtering Targets combine superior quality with competitive pricing. Our Strontium Iron Oxide Sputtering Targets, available in the highest purity and various sizes, are the ideal raw materials for your research and production needs.

MSDS File

Strontium Iron Oxide Sputtering Target Description

The Strontium Iron Oxide Sputtering Target offers a unique combination of properties that make it an excellent choice for various applications. Its high purity ensures consistent and defect-free film deposition, while its high density provides exceptional physical strength and stability, making it ideal for demanding environments. The high sputtering rate facilitates efficient film deposition, and the low resistivity promotes effective electron transport. Additionally, the target exhibits outstanding chemical stability, resisting corrosion in harsh conditions, and has high-temperature oxidation resistance, ensuring durability under extreme conditions. This combination of attributes makes it a versatile and reliable option for a wide range of industrial applications.

Related Product: Strontium Sputtering Target, Strontium Oxide Sputtering Target

Strontium Iron Oxide Sputtering Target Specifications

Compound FormulaSrFe12O19
Molecular Weight327.84
AppearanceBlack Target
Density (g/cm3)8.02
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Strontium Iron Oxide Sputtering Target Handling Notes

Indium bonding is recommended for Strontium Iron Oxide Sputtering Targets due to their inherent characteristics that pose challenges during sputtering. The material’s low thermal conductivity and susceptibility to thermal shock can lead to issues such as uneven deposition and target degradation. Using indium bonding helps address these challenges by providing a more stable and reliable attachment, ensuring consistent performance and reducing the risk of thermal stress-related problems during the sputtering process.

Strontium Iron Oxide Sputtering Target Application

Strontium Iron Oxide Sputtering Targets find extensive application in various high-tech fields due to their remarkable properties. Key applications include:

  • Magnetic Recording and Storage: Utilized for magnetic recording media, such as magnetic heads and magnetic memories, enhancing the performance and stability of storage technology with their high saturation magnetization and stability.
  • Electronic Device Manufacturing: Used to produce magnetic films, resistors, and transformers, improving the performance and stability of electronic components.
  • Energy Conversion and Storage: Employed in creating electrode materials for solar cells, fuel cells, and electrochemical devices, enhancing efficiency and longevity in energy technologies.
  • Sensor Manufacturing: Leveraged for magnetic and current sensors, with applications in industrial automation, automotive electronics, and medical devices, thanks to their excellent magnetic and electrical properties.
  • Additional Fields: Also applied in microelectronic packaging, precision machining, medical devices, and aerospace, demonstrating versatility across various industries.

Strontium Iron Oxide Sputtering Target Packaging

Our Strontium Iron Oxide Sputtering Target is meticulously handled during storage and transportation to ensure that the product maintains its high quality and integrity in its original condition.

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TFM’s Strontium Iron Oxide Sputtering Target is available in various forms, purities, and sizes. We specialize in producing high-purity physical vapor deposition (PVD) materials with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD), and physical vapor deposition (PVD) display and optical applications.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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