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ST0047E Strontium Lead Oxide Sputtering Targets (Sr3PbO)

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Strontium Lead Oxide Sputtering Targets

TFM provides high-quality Strontium Lead Oxide (SrPbO₃) Sputtering Targets, designed for use in thin-film deposition applications. These targets are ideal for industries such as electronics, photovoltaics, and optical coatings, where high-performance materials are required. Strontium Lead Oxide is valued for its ferroelectric and electronic properties, making it an essential material for advanced devices.

Key Features and Advantages

  • High Purity – TFM’s Strontium Lead Oxide sputtering targets are available in 99.9% purity, ensuring optimal deposition quality for demanding applications.

  • Ferroelectric Properties – Known for ferroelectric behavior, these targets are used in devices that require non-volatile memory and capacitors.

  • High Performance in Thin Film Deposition – Excellent for producing high-quality thin films that are used in semiconductor, piezoelectric, and optical applications.

  • Customizable Sizes – Custom dimensions are available to meet specific project requirements, making these targets ideal for research and industrial applications.

  • Stable and Durable – Produced with cold pressing and sintering techniques, ensuring long-lasting performance in high-demand deposition environments.

Specifications

  • Purity: 99.9%

  • Target Types Available:

    • Circular Targets: Diameter ≤ 14 inches, Thickness ≥ 1mm

    • Block Targets: Length ≤ 32 inches, Width ≤ 12 inches, Thickness ≥ 1mm

Applications

  • Ferroelectrics – Ideal for use in memory devices, capacitors, and actuators due to their excellent ferroelectric properties.

  • Thin-Film Transistors (TFTs) – Suitable for semiconductor applications such as flat-panel displays, OLEDs, and solar cells.

  • Optical Coatings – Used for the fabrication of optical coatings, including antireflection coatings, filters, and mirror coatings.

  • Piezoelectric Devices – Applied in the manufacture of sensors, actuators, and energy harvesting devices.

Manufacturing Process

  • Cold Pressing & Sintering – Ensures a high-density target, optimizing sputtering performance for consistent thin-film deposition.

  • Elastomer Bonding – Bonded to a backing plate to improve handling and deposition uniformity.

  • Cleaning & Packaging – Thoroughly cleaned and packaged to protect against contamination during shipping and to ensure reliability in vacuum environments.

Options

  • Custom Sizing – Targets can be produced in custom sizes to meet specific application requirements, including research and large-scale manufacturing.

  • Research and Development – Smaller sizes are available for R&D purposes, offering flexibility for experimental and prototype development.

  • Sputtering Target Bonding Service – Enhanced performance is achievable through our sputtering target bonding services, ensuring superior film quality and durability.

Industry Impact

TFM’s Strontium Lead Oxide Sputtering Targets are pivotal for ferroelectric, semiconductor, and optical applications. The targets are designed to meet the needs of cutting-edge industries such as electronics, energy storage, and thin-film coatings. With high purity and superior film deposition characteristics, they support the creation of advanced functional materials required in high-performance devices.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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