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VD0727 Strontium Ruthenate Evaporation Materials, SrRuO3

Catalog No.VD0727
MaterialStrontium Ruthanate (SrRuO3)
Purity99.9%
ShapePowder/ Granule/ Custom-made

TFM is a top manufacturer and supplier of high-purity strontium ruthenate evaporation materials, along with a diverse range of other evaporation materials. Our products are available in both powder and granule forms, with customized options provided upon request.

MSDS File

Strontium Ruthenate Evaporation Materials Overview

Strontium ruthenate (SrRuO3) evaporation materials are vital in the deposition industry, providing an oxide material essential for achieving high-quality deposited films. Our strontium ruthenate materials are produced with exceptional precision, reaching purities up to 99.9995%. Rigorous quality assurance processes ensure that these materials consistently deliver superior performance and reliability.

Applications of Strontium Ruthenate Evaporation Materials

Strontium ruthenate evaporation materials are used across a range of applications:

  • Deposition Processes: Ideal for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Suitable for wear protection, decorative coatings, and display technologies.

Packaging and Quality Control

To maintain the highest standards of quality and ensure efficient identification, strontium ruthenate evaporation materials are meticulously tagged and labeled. We take great care to protect these materials from damage during both storage and transportation.

Contact Us

TFM is a premier provider of high-purity strontium ruthenate evaporation materials. We offer these materials in various forms, including tablets, granules, rods, and wires, with custom options available upon request. In addition, we supply evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For the latest pricing and information on materials not listed, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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