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ST0188 Strontium Ruthenate Sputtering Target, SrRuO3

Chemical Formula: SrRuO3
Catalog Number: ST0188
CAS Number: 60862-59-1
Purity: >99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Strontium Ruthenate  sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Strontium Ruthenate Sputtering Target Description

Strontium ruthenate sputtering target from TFM is an oxide sputtering material containing strontium (Sr), ruthenium (Ru), and oxygen (O). This material is commonly used in thin film deposition processes for various applications, including electronic and optical devices.

StrontiumStrontium is a chemical element that originated from Strontian, a small town in Scotland. It was first mentioned in 1787 and observed by William Cruikshank. The isolation was later accomplished and announced by Sir Humphry Davy. The canonical chemical symbol for strontium is “Sr,” and it has an atomic number of 38. Strontium is located in Period 5 and Group 2 of the periodic table, belonging to the s-block. The relative atomic mass of strontium is 87.62(1) Dalton, with the number in the brackets indicating the measurement uncertainty. Strontium compounds are used in various applications, including pyrotechnics and glass production.

Related Product: Strontium Sputtering Target

RutheniumRuthenium is a chemical element that originated from the Latin name “Ruthenia,” referring to Russia. It was first mentioned in 1807 and observed by Jędrzej Śniadecki. The isolation of ruthenium was later accomplished and announced by Śniadecki. The canonical chemical symbol for ruthenium is “Ru,” and it has an atomic number of 44. Ruthenium is located in Period 5 and Group 8 of the periodic table, within the d-block. The relative atomic mass of ruthenium is 101.07(2) Dalton, with the number in brackets indicating the uncertainty. Ruthenium is used in various applications, including electronics, catalysis, and as a hardening agent for platinum and palladium.

Related Product: Ruthenium Sputtering Target

OxygenOxygen is a chemical element that derives its name from the Greek words ‘oxy’ and ‘genes,’ meaning acid-forming. It was first mentioned in 1771 and observed by Carl Wilhelm Scheele. The successful isolation of oxygen was later confirmed and announced by Scheele. The canonical chemical symbol for oxygen is “O,” and it has an atomic number of 8. Oxygen is located in Period 2 and Group 16 of the periodic table, belonging to the p-block. The relative atomic mass of oxygen is 15.9994(3) Dalton, with the number in the brackets indicating the uncertainty. Oxygen is essential for life and plays a crucial role in various chemical reactions, including combustion and respiration.

Strontium Ruthenate Sputtering Target Packaging

Our strontium ruthenate sputtering target is clearly tagged and labeled externally to ensure efficient identification and quality control. We take great care in handling and packaging to prevent any damage that might occur during storage or transportation, ensuring the product arrives in pristine condition.

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TFM offers Strontium Ruthenate Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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