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Strontium Zirconate Sputtering Target

ST0190 Strontium Zirconate Sputtering Target, SrZrO3

Chemical Formula: SrZrO3
Catalog Number: ST0190
CAS Number: 12036-39-4
Purity: >99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Strontium Zirconate  sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Strontium Zirconate Sputtering Target Description

The strontium zirconate sputtering target from TFM is an oxide sputtering material containing Sr, Zr, and O.

StrontiumStrontium is a chemical element named after Strontian, a small town in Scotland. It was first identified in 1787 by William Cruikshank, and the element was later isolated and announced by Humphry Davy. The chemical symbol for strontium is “Sr,” and its atomic number is 38. Strontium is located in Period 5, Group 2 of the periodic table, belonging to the s-block. Its relative atomic mass is 87.62(1) Dalton, with the number in brackets indicating the measurement uncertainty.

Related Product: Strontium Sputtering Target

ZirconiumZirconium is a chemical element that takes its name from the Persian word ‘zargun,’ meaning gold-colored. The element was first mentioned in 1789 and was observed by the chemist Martin Heinrich Klaproth. The isolation of zirconium was later accomplished and announced by Jöns Jacob Berzelius. The chemical symbol for zirconium is “Zr,” and it has an atomic number of 40. Zirconium is located in Period 5, Group 4 of the periodic table, within the d-block. The relative atomic mass of zirconium is 91.224(2) Dalton, with the number in brackets indicating the uncertainty of the measurement.

Related Product: Zirconium Sputtering Target

OxygenOxygen is a chemical element with the canonical chemical symbol “O.” It originated from the Greek words ‘oxy’ and ‘genes,’ meaning acid-forming. The element was first mentioned in 1771 and observed by the Swedish chemist Carl Wilhelm Scheele. The successful isolation of oxygen was later accomplished and announced by Scheele himself. In the periodic table, oxygen has an atomic number of 8 and is located at Period 2, Group 16, belonging to the p-block. The relative atomic mass of oxygen is 15.9994(3) Dalton, with the number in brackets indicating the measurement uncertainty.

Strontium Zirconate Sputtering Target Packaging

Our strontium zirconate sputtering target is clearly tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to avoid any damage during storage or transportation, ensuring that the product arrives in pristine condition.

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TFM offers Strontium Zirconate Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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