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ST0190 Strontium Zirconate Sputtering Target, SrZrO3

Chemical Formula: SrZrO3
Catalog Number: ST0190
CAS Number: 12036-39-4
Purity: >99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Strontium Zirconate  sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

Strontium Zirconate (SrZrO₃) Sputtering Targets are advanced ceramic targets widely used in thin film deposition for high-temperature electronics, dielectric coatings, and oxide materials research. As a perovskite-structured oxide, SrZrO₃ exhibits excellent thermal stability, chemical resistance, and dielectric properties, making it a valuable material for electronic, optical, and energy-related applications.

In Physical Vapor Deposition (PVD) systems such as RF magnetron sputtering, SrZrO₃ targets enable the deposition of high-quality strontium zirconate thin films with controlled stoichiometry and uniform microstructure. These films are widely studied in high-temperature electronics, oxide semiconductor devices, and functional ceramic coatings.

Detailed Description

Strontium Zirconate Sputtering Targets are produced from high-purity strontium oxide and zirconium oxide precursor materials through controlled ceramic synthesis methods. Typical manufacturing processes include powder mixing, calcination, cold pressing, and high-temperature sintering, which produce dense targets with homogeneous composition and stable crystal structure.

SrZrO₃ belongs to the perovskite oxide family, which includes many materials with significant electronic, dielectric, and ionic conduction properties. One of the key advantages of strontium zirconate is its exceptional thermal and chemical stability, allowing thin films to maintain structural integrity under high-temperature or chemically aggressive environments.

Because SrZrO₃ is an electrically insulating ceramic oxide, deposition is typically performed using RF magnetron sputtering, which allows stable plasma generation and consistent sputtering of oxide materials. Thin films produced from SrZrO₃ targets can exhibit:

  • excellent dielectric properties

  • high thermal stability

  • strong resistance to chemical corrosion

  • compatibility with other perovskite oxide materials

These characteristics make SrZrO₃ thin films suitable for use in dielectric layers, high-temperature electronic components, and experimental oxide electronics.

SrZrO₃ sputtering targets are available in circular discs, rectangular plates, and custom geometries compatible with a wide range of sputtering cathodes. For larger targets or high-power sputtering systems, the targets may be bonded to copper backing plates using indium bonding or elastomer bonding to improve heat dissipation and mechanical stability.

High-density targets help maintain stable sputtering rates, reduce particle generation, and ensure uniform thin film deposition.

Applications

Thin films deposited from Strontium Zirconate Sputtering Targets are used in a variety of advanced technologies:

  • High-temperature dielectric coatings – insulating layers for electronic devices operating in harsh environments.

  • Oxide electronics – functional oxide thin films used in semiconductor and electronic research.

  • Solid oxide fuel cell (SOFC) research – materials used in experimental high-temperature electrochemical devices.

  • Protective ceramic coatings – corrosion-resistant and thermally stable coatings.

  • Thin film capacitors – dielectric layers used in electronic components.

  • Materials science research – investigation of perovskite oxide thin films.

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% – 99.99%High purity improves dielectric and electronic film properties
Density≥95% theoreticalEnsures stable sputtering performance
Diameter25 – 300 mm (custom)Compatible with various sputtering cathodes
Thickness3 – 6 mmInfluences sputtering rate and target lifetime
BondingCopper backing plate (optional)Improves heat transfer and mechanical stability

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Strontium Zirconate (SrZrO₃)Excellent thermal stability and dielectric propertiesHigh-temperature electronics and oxide thin films
Strontium Titanate (SrTiO₃)Strong dielectric and electronic propertiesOxide electronics and substrates
Zirconium Oxide (ZrO₂)High chemical and thermal stabilityProtective and thermal barrier coatings

FAQ

QuestionAnswer
Can SrZrO₃ sputtering targets be customized?Yes, target diameter, thickness, density, and backing plate bonding options can be customized to match specific sputtering systems.
Which sputtering method is recommended for SrZrO₃ targets?RF magnetron sputtering is typically used because strontium zirconate is an insulating ceramic oxide.
Are bonded targets available?Yes, SrZrO₃ targets can be indium-bonded or elastomer-bonded to copper backing plates for improved thermal management.
What substrates are compatible with SrZrO₃ thin films?Silicon wafers, sapphire, glass, and oxide substrates are commonly used in electronic and materials research.
Which industries commonly use SrZrO₃ sputtering targets?Semiconductor research laboratories, energy materials research centers, and advanced materials science institutes.

Packaging

Our Strontium Zirconate Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and maintain strict quality control standards. Each target is vacuum-sealed and carefully packaged with protective cushioning materials to prevent contamination or mechanical damage during storage and transportation. Export-grade cartons or wooden crates are used to ensure safe international delivery.

Conclusion

The Strontium Zirconate (SrZrO₃) Sputtering Target is a high-performance ceramic target designed for the deposition of thermally stable dielectric and functional oxide thin films. Its perovskite crystal structure, excellent chemical resistance, and high-temperature stability make it particularly suitable for advanced electronic devices, oxide electronics, and energy-related materials research.

With high purity levels, customizable dimensions, and reliable manufacturing processes, SrZrO₃ sputtering targets provide consistent performance for both research laboratories and industrial thin film deposition systems.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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