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Tantalum Aluminum Evaporation Materials

VD0646 Tantalum Aluminum Evaporation Materials, Ta/Al

Catalog No.VD0646
MaterialTantalum Aluminum (Ta/Al)
Purity99.9% ~ 99.95%
ShapePowder/ Granule/ Custom-made

Thin-Film Mat Engineering (TFM) is a premier manufacturer and supplier of high-purity tantalum aluminum evaporation materials. Our range includes both powder and granule forms, and we can provide customized options tailored to your specific needs.

MSDS File

Tantalum Aluminum Evaporation Materials Overview

Tantalum aluminum evaporation materials, provided by TFM, consist of a high-purity alloy of tantalum (Ta) and aluminum (Al). These materials are crucial for achieving superior film quality during various deposition processes. TFM ensures their evaporation materials reach an exceptional purity level of up to 99.9995%, thanks to rigorous quality control measures that enhance product dependability.

Related Products: Tantalum Evaporation Materials, Aluminum Evaporation Materials

Applications of Tantalum Aluminum Evaporation Materials

Tantalum aluminum evaporation materials are widely used in several advanced applications:

  • Deposition Processes: Essential for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optical Coatings: Ideal for wear-resistant coatings, decorative finishes, and display technologies.

Packaging and Handling

Each shipment of tantalum aluminum evaporation materials is meticulously tagged and labeled to ensure clear identification and maintain stringent quality control. We prioritize the safe handling of these materials to prevent any damage during storage and transportation.

Contact Us

TFM stands as a leading manufacturer and supplier of high-purity tantalum aluminum evaporation materials. We offer various forms including tablets, granules, rods, and wires. Custom shapes and quantities can be requested. Additionally, TFM provides related products such as evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and to inquire about materials not listed, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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