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ST0110 Tantalum Aluminum Sputtering Target, Ta/Al

Chemical Formula: Ta/Al
Catalog Number: ST0110
CAS Number: 7440-25-7 | 7429
Purity: 99.9%, 99.95%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Tantalum Aluminum sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Magnesium Evaporation Materials

Introduction

Magnesium Evaporation Materials are widely used in thin film deposition due to magnesium’s excellent reactivity, low density, and ability to form high-purity coatings. As one of the lightest structural metals, magnesium provides unique optical, electrical, and protective properties when deposited as a thin film. It plays a vital role in industries ranging from microelectronics to optics, energy devices, and protective coatings.

Detailed Description

Magnesium evaporation materials are typically provided in pellets, pieces, granules, or rods, engineered to meet the requirements of thermal or electron beam (e-beam) evaporation systems.

Key features include:

  • High Purity (99.9%–99.99%): Prevents contamination in thin film applications.

  • Low Density (1.74 g/cm³): Enables lightweight coatings suitable for aerospace and electronics.

  • Good Reactivity: Forms compounds with oxygen, nitrogen, and fluorine, useful for advanced thin films.

  • Excellent Optical Properties: Transparent to infrared and visible light, ideal for optical coatings.

  • Versatility: Can be deposited in pure form or as part of compound layers (e.g., MgO).

Applications

Magnesium evaporation materials are used across diverse industries:

  • Optical Coatings: Anti-reflective and dielectric layers on lenses, mirrors, and displays.

  • Semiconductors & Microelectronics: Passivation layers and compound semiconductor films.

  • Energy Devices: Thin films for batteries, fuel cells, and photovoltaic devices.

  • Protective Coatings: Oxidation and corrosion-resistant films.

  • Research & Development: Thin film studies in material science and nanotechnology.

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% – 99.99%Higher purity ensures defect-free films
Forms AvailablePellets, granules, rods, piecesMatches e-beam and thermal evaporation sources
Melting Point650 °CSuitable for evaporation at relatively low temperatures
Density1.74 g/cm³Lightweight coatings for electronics and aerospace
Evaporation MethodThermal / e-beamProvides flexibility for different thin film systems

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Magnesium (Mg)Lightweight, excellent reactivityOptical coatings, thin films
Aluminum (Al)High reflectivity, cost-effectiveMirrors, electronics
Calcium (Ca)High reactivity, forms transparent oxidesDielectric layers

FAQ

QuestionAnswer
What forms are available?Magnesium is supplied as pellets, pieces, granules, or rods depending on the evaporation source.
How is it packaged?Sealed in vacuum or argon-filled containers, with moisture-protective outer packaging.
What is the delivery time?Usually 2–3 weeks depending on order size and customization.
Can it be customized?Yes, size, shape, and purity can be tailored for specific deposition systems.
Which industries use it most?Optics, semiconductors, aerospace, energy, and R&D.

Packaging

Magnesium evaporation materials are moisture-sensitive and carefully sealed in vacuum-packed or argon-filled bottles. For added safety, the materials are stored with desiccants and shipped in protective cartons or wooden crates to prevent oxidation and contamination.

Conclusion

Magnesium Evaporation Materials are an essential source for producing lightweight, high-purity thin films with unique optical and electronic properties. Their combination of low melting point, high reactivity, and excellent versatility makes them a preferred choice for optical, electronic, and energy-related applications.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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