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VD0838 Tantalum Boride Evaporation Materials, TaB2

Catalog No.VD0838
MaterialTantalum Boride (TaB2)
Purity99.5%
ShapePowder/ Granule/ Custom-made

TFM stands out as a top producer and supplier of premium tantalum boride evaporation materials, renowned for their exceptional purity. Our diverse range of evaporation materials is available in both powder and granule forms, catering to various industrial needs. For unique specifications, we also provide tailored solutions upon request.

Tantalum Boride Evaporation Materials Overview

TFM’s tantalum boride evaporation materials consist of a boride ceramic with the chemical formula TaB2. These high-purity TaB2 materials are crucial for deposition processes, ensuring the production of high-quality thin films. Our specialized manufacturing process guarantees materials with purity levels up to 99.9995%, supported by rigorous quality assurance to ensure product reliability.

Specifications of Tantalum Boride Evaporation Materials

Material TypeTantalum Boride
SymbolTaB2
Appearance/ColorGrey to black solid
Melting Point> 3000 °C
Density11.15 g/cm3
Purity99.5%
ShapePowder/ Granule/ Custom-made

Applications of Tantalum Boride Evaporation Materials

Our tantalum boride evaporation materials are used in various deposition processes, including:

  • Semiconductor Deposition
  • Chemical Vapor Deposition (CVD)
  • Physical Vapor Deposition (PVD)

They are primarily applied in optics and are essential for:

  • Wear Protection
  • Decorative Coatings
  • Displays

Packaging and Handling

TFM ensures that tantalum boride evaporation materials are clearly tagged and labeled for easy identification and quality control. We take meticulous care during storage and transportation to prevent any potential damage.

Contact Us

TFM is a premier manufacturer and supplier of high-purity tantalum boride evaporation materials. We offer various shapes such as tablets, granules, rods, and wires, and can provide customized forms and quantities upon request. Additionally, we supply evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and additional information, please send us an inquiry.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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