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tantalum-carbide

VD0767 Tantalum Carbide Evaporation Materials, TaC

Catalog No.VD0767
MaterialTantalum Carbide (TaC)
Purity99.5%
ShapePowder/ Granule/ Custom-made

TFM is a prominent name in the field of manufacturing and supplying high-purity Tantalum Carbide evaporation materials. We offer a diverse range of evaporation materials, available in both powder and granule forms. Additionally, we provide customized solutions to meet specific requirements upon request.

MSDS File

Tantalum Carbide Evaporation Materials Overview

Tantalum Carbide (TaC) is a high-purity carbide ceramic used extensively in evaporation processes. Known for its exceptional melting point and density, TaC is integral in producing high-quality deposited films. TFM excels in manufacturing Tantalum Carbide evaporation materials with a purity level reaching up to 99.9995%, ensuring superior performance and reliability through rigorous quality control.

Tantalum Carbide Evaporation Materials Specification

Material TypeTantalum Carbide
SymbolTaC
Appearance/ColorBrown-gray Solid
Melting Point3,768 °C (6,814 °F; 4,041 K)
Density14.3~14.65 g/cm3
Purity99.5%
ShapePowder/ Granule/ Custom-made

Applications

Tantalum Carbide evaporation materials are widely utilized in:

  • Deposition Processes: Essential for semiconductor deposition, Chemical Vapor Deposition (CVD), and Physical Vapor Deposition (PVD).
  • Optics: Applied in wear protection, decorative coatings, and display technologies.

Packaging and Handling

Our Tantalum Carbide evaporation materials are meticulously tagged and labeled for easy identification and quality assurance. We take stringent measures to prevent damage during storage and transportation.

Contact Us

TFM stands out as a premier manufacturer and supplier of high-purity Tantalum Carbide evaporation materials. We offer various forms, including tablets, granules, rods, and wires, with customization options available. In addition to evaporation materials, we provide evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and additional information, please reach out with your inquiry.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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