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ST0228 Tantalum Carbide Sputtering Target, TaC

Chemical Formula: TaC
Catalog Number: ST0228
CAS Number: 12070-06-3
Purity: 99.5%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Tantalum Carbide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

Tantalum Carbide Sputtering Targets are advanced ceramic targets designed for depositing ultra-hard, chemically stable, and high-temperature-resistant thin films. With an exceptionally high melting point and outstanding mechanical strength, tantalum carbide–based coatings are widely used in demanding environments where conventional metallic or nitride coatings may fail.

Detailed Description

Our Tantalum Carbide Sputtering Targets are produced from high-purity tantalum and carbon through controlled powder processing and high-temperature sintering. This manufacturing route ensures precise stoichiometry, high density, and a uniform microstructure—all of which are critical for stable sputtering performance and consistent film quality.

Compared with metallic tantalum targets, tantalum carbide offers significantly higher hardness, superior wear resistance, and improved stability under high thermal loads. These characteristics make it especially suitable for high-power sputtering and applications involving elevated substrate temperatures. The dense ceramic structure helps reduce particle generation, abnormal arcing, and non-uniform erosion during deposition.

Tantalum Carbide targets are typically used in RF magnetron sputtering systems due to their ceramic nature, and in some cases pulsed DC sputtering can also be applied depending on system configuration. Targets can be supplied as monolithic ceramics or bonded to copper backing plates to improve heat dissipation and mechanical support. Standard and fully customized sizes are available to match a wide range of sputtering cathodes.

Applications

Tantalum Carbide Sputtering Targets are commonly used in:

  • Hard and wear-resistant thin-film coatings

  • Cutting tools and mold surface protection

  • Semiconductor and microelectronic coatings

  • Diffusion barriers and protective layers

  • Aerospace, energy, and high-temperature applications

They are particularly suitable for applications requiring extreme hardness, thermal stability, and long service life.

Technical Parameters

ParameterTypical Value / RangeImportance
MaterialTantalum Carbide (TaC)Provides extreme hardness and thermal stability
Purity99.5% – 99.9%Minimizes impurities affecting film performance
Density≥ 95–99% theoreticalEnsures stable sputtering and uniform erosion
ShapeRound / Rectangular / CustomCompatible with various sputtering systems
Sputtering ModeRF / Pulsed DC (process-dependent)Suitable for ceramic targets
Backing PlateCopper (optional)Improves heat transfer and target lifetime

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Tantalum CarbideExtreme hardness, very high melting pointHigh-wear and high-temperature coatings
Tantalum NitrideGood conductivity, barrier performanceSemiconductor diffusion barriers
Titanium CarbideLower density, good hardnessTool and decorative coatings

FAQ

QuestionAnswer
Is tantalum carbide electrically conductive?Tantalum carbide has limited conductivity; RF sputtering is generally recommended.
Can the target be bonded to a backing plate?Yes, copper backing plates are available to enhance cooling and stability.
Are custom sizes and thicknesses available?Yes, full customization is supported.
Is it suitable for high-temperature applications?Yes, tantalum carbide performs exceptionally well at elevated temperatures.

Packaging

Our Tantalum Carbide Sputtering Targets are carefully tagged and labeled for traceability. Each target is vacuum-sealed and packaged with protective materials to prevent contamination or mechanical damage during storage and transportation.

Conclusion

Tantalum Carbide Sputtering Targets provide a reliable solution for depositing ultra-hard, thermally stable ceramic coatings in demanding environments. With high purity, dense microstructure, and consistent sputtering behavior, they are well suited for both advanced research and industrial production.
For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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