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Tantalum Diselenide Evaporation Materials

VD0852 Tantalum Diselenide Evaporation Materials, TaSe2

Catalog No.VD0852
MaterialTantalum Selenide (TaSe2)
Purity99.9%
ShapePowder/ Granule/ Custom-made

TFM is a prominent manufacturer and supplier specializing in high-purity tantalum diselenide (TaSe₂) evaporation materials, among a diverse range of other evaporation materials. We provide these materials in both powder and granule forms, with customized shapes available upon request to meet specific needs and applications.

MSDS File

Tantalum Diselenide Evaporation Materials Overview

Tantalum diselenide evaporation materials, identified by the chemical formula TaSe₂, are essential for high-precision deposition processes. At TFM, we offer high-purity TaSe₂ with purity levels reaching up to 99.9995%, ensuring superior quality in your deposited films. Our commitment to rigorous quality assurance processes guarantees the reliability and performance of our evaporation materials.

Related Products: Tantalum Evaporation Materials, Selenide Ceramic Evaporation Materials

Specifications of Tantalum Diselenide Evaporation Materials

Material TypeTantalum diselenide
SymbolTaSe2
Appearance/ColorSilverish/goldish solid
Melting Point2000 °C (3632 °F)
Density6.70 g/cm3
Purity99.9% ~ 99.999%
ShapePowder/ Granule/ Custom-made

Applications of Tantalum Diselenide Evaporation Materials

Our tantalum diselenide evaporation materials are widely used in various deposition techniques, including semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD). They are ideal for applications in optics, such as wear protection, decorative coatings, and displays, enhancing both functionality and aesthetics.

Packaging and Handling

To ensure optimal quality and ease of use, our tantalum diselenide evaporation materials are clearly tagged and labeled. We take great care to package the materials securely to prevent any damage during storage and transportation.

Contact Us

TFM is a premier provider of high-purity tantalum diselenide evaporation materials. We offer a range of forms, including tablets, granules, rods, and wires, with custom options available upon request. Additionally, we supply various evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For inquiries about current prices or materials not listed, please contact us.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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