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tantalumiv-sulfide

VD0825 Tantalum(IV) Sulfide Evaporation Materials, TaS2

Catalog No.VD0825
MaterialTantalum Sulfide (TaS2)
Purity99.9%
ShapePowder/ Granule/ Custom-made

TFM stands out as a top manufacturer and supplier specializing in high-purity tantalum(IV) sulfide, among other advanced evaporation materials. Our extensive product range includes both powder and granule forms of evaporation materials, with options for customized forms available to meet specific needs.

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Tantalum(IV) Sulfide Evaporation Materials Overview

TFM offers high-purity tantalum(IV) sulfide evaporation materials, ideal for use in deposition processes. These sulfide ceramics, with the chemical formula TaS2, are crucial in ensuring the production of high-quality thin films during various coating applications. TFM specializes in producing materials with up to 99.9995% purity, supported by robust quality assurance procedures to maintain reliability and consistency.

Available Products

Tantalum(IV) Sulfide Evaporation Materials Specifications

Material TypeTantalum(IV) sulfide
SymbolTaS2
Appearance/ColorGolden or black crystals, depending on polytype
Melting Point>3000 °C
Density6.86 g/cm3
Purity99.9%
ShapePowder/ Granule/ Custom-made

Applications of Tantalum(IV) Sulfide Evaporation Materials

These materials are essential in a variety of deposition techniques, including semiconductor, chemical vapor deposition (CVD), and physical vapor deposition (PVD). Tantalum(IV) sulfide is commonly used for optical coatings, wear-resistant surfaces, decorative finishes, and display technology.

Packaging and Handling

To ensure optimal product identification and maintain quality control, TFM labels all tantalum(IV) sulfide evaporation materials with detailed external tagging. Special precautions are taken to prevent damage during storage and transportation, ensuring the material arrives in excellent condition.

Contact TFM

TFM is a trusted supplier of high-purity tantalum(IV) sulfide evaporation materials, available in various shapes such as tablets, granules, rods, and wires. Customization options are also available for specific needs. In addition to evaporation materials, TFM provides a range of supporting products, including evaporation sources, crucibles, filaments, and more. For pricing or inquiries about other materials not listed, please reach out to us for more information.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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