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ST0286 Tantalum Sulfide Sputtering Target, TaS2

Chemical Formula: TaS2
Catalog Number: ST0286
CAS Number: 12143-72-5
Purity: >99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Tantalum Sulfide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Tantalum Sulfide Sputtering Target Description

Tantalum sulfide sputtering target is a specialized type of sulfide ceramic sputtering target composed of tantalum (Ta) and sulfur (S). This material is commonly used in various applications, including thin film deposition, where it plays a crucial role in the production of coatings for semiconductors, displays, photovoltaic devices, and other optical components. Its properties make it suitable for creating films with specific electrical, optical, and mechanical characteristics.

Tantalum

Tantalum is a chemical element with the symbol “Ta” and atomic number 73. It is named after King Tantalus from Greek mythology. The element was first mentioned in 1802 and discovered by the Swedish chemist Anders Gustav Ekeberg. Tantalum is a transition metal located in the d-block of the periodic table, specifically in Period 6 and Group 5. The relative atomic mass of tantalum is 180.94788(2) Dalton, with the number in brackets indicating the measurement uncertainty. Tantalum is known for its high melting point, corrosion resistance, and ability to form thin oxide films, making it useful in electronics, aerospace, and other high-tech applications.

Related Product: Tantalum Sputtering Target

SulfurSulfur, also called **sulphur**, is a chemical element with the symbol “S” and atomic number 16. Its name is derived from either the Sanskrit word ‘sulvere’ or the Latin ‘sulfurium,’ both referring to sulfur. This element has been known and used since before 2000 BC, with early applications by Chinese and Indian civilizations. Sulfur is located in Period 3 and Group 16 of the p-block in the periodic table. The relative atomic mass of sulfur is 32.065(5) Dalton, with the number in brackets indicating the measurement uncertainty. Sulfur is a non-metal known for its distinct yellow color and is used in various industrial processes, including the production of sulfuric acid, fertilizers, and in vulcanization of rubber.

Tantalum Sulfide Sputtering Target Specification

Compound FormulaTaS
AppearanceGray to black target
Melting Point3,000° C
Density6.86 g/cm3
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

Tantalum Sulfide Sputtering Target Application

The tantalum sulfide sputtering target is utilized in various applications, including:

  1. Thin Film Deposition: Essential in creating thin layers for different technologies.
  2. Decorative Coatings: Used in applications where aesthetic appeal is important.
  3. Semiconductor Industry: Helps in manufacturing semiconductor devices.
  4. Display Technology: Used in the production of display screens.
  5. LED and Photovoltaic Devices: Plays a role in the development of energy-efficient and solar devices.
  6. Functional Coatings: Applied in various industrial processes to enhance material properties.
  7. Optical Information Storage: Used in the optical storage industry.
  8. Glass Coating Industry: Essential in coating car glass and architectural glass.
  9. Optical Communication: Utilized in communication technologies requiring high precision and efficiency.

Tantalum sulfide sputtering targets are valued for their ability to produce high-quality coatings and films with specific properties tailored to these diverse applications.

Tantalum Sulfide Sputtering Target Packing

Our tantalum sulfide sputter targets are meticulously tagged and labeled externally to ensure efficient identification and quality control. We take great care in handling these targets to prevent any damage that might occur during storage or transportation, maintaining their integrity and performance for end-use applications.

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TFM offers tantalum sulfide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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