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ST0048 Tantalum Sputtering Target, Ta

Chemical Formula:Ta
Catalog Number: ST0048
CAS Number: 7440-25-7
Purity: 99.95%, 99.99%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Tantalum sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Tantalum Sputtering Target

Introduction

The Tantalum (Ta) Sputtering Target is a high-purity metallic material widely used in the semiconductor, optical, and thin film industries. Known for its excellent corrosion resistance, high melting point, and chemical stability, tantalum is a critical material for barrier layers, protective coatings, and microelectronic applications. Its unique combination of electrical conductivity and oxidation resistance makes it one of the most versatile targets in physical vapor deposition (PVD).

Detailed Description

Tantalum is a refractory metal with a melting point of 3017 °C, outstanding ductility, and superior resistance to most acids and chemicals. When sputtered, tantalum forms dense, uniform thin films with excellent adhesion and consistent thickness control.

The tantalum sputtering target is typically fabricated by electron-beam melting, powder metallurgy (PM), or vacuum sintering, followed by hot working to achieve fine-grain structure and high density. These manufacturing methods ensure reliable performance during high-power sputtering and minimize particle generation.

Key Features:

  • High purity (up to 99.999%) for contamination-free coatings.

  • Excellent corrosion resistance in acidic and plasma environments.

  • High thermal and chemical stability during long deposition cycles.

  • Uniform grain structure for consistent sputtering rate and film quality.

  • Available in multiple configurations – planar, rotary, and bonded types.

Applications

Tantalum sputtering targets are widely used in:

  • Semiconductor devices – diffusion barriers, capacitor electrodes, and gate layers.

  • Integrated circuits (ICs) – Ta/TaN films as Cu diffusion barriers.

  • Optical coatings – durable, high-refractive-index layers for lenses and sensors.

  • Medical and aerospace coatings – biocompatible and corrosion-resistant films.

  • Thin film resistors and capacitors – stable conductive layers.

  • Energy and R&D sectors – advanced coatings in fusion, vacuum, and microelectronics.

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.95% – 99.999%Ensures minimal film contamination
Density≥ 16.6 g/cm³ (theoretical)Improves sputtering efficiency
Grain Size≤ 100 µm (fine-grained)Enhances film uniformity
Diameter25 – 300 mm (custom)Compatible with various sputtering systems
Thickness3 – 10 mmBalances deposition stability and target life
Backing PlateCopper / MolybdenumEnhances heat transfer and bonding strength

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Tantalum (Ta)Excellent corrosion resistance, high puritySemiconductors, optics
Tantalum Nitride (TaN)Diffusion barrier, stable resistivityICs and resistors
Tungsten (W)High melting point, conductivityHigh-temp coatings
Titanium (Ti)Lightweight, strong adhesionDecorative & protective coatings

FAQ

QuestionAnswer
Can tantalum targets be customized?Yes, in shape, size, and purity levels up to 5N.
What bonding options are available?Commonly copper or molybdenum backplates.
Is it compatible with DC sputtering?Yes, ideal for DC magnetron sputtering.
What is the typical film appearance?Metallic silver-gray with dense, smooth texture.
How is the target packaged?Vacuum-sealed with desiccants and foam-protected in wooden crates.

Packaging

Each Tantalum Sputtering Target is carefully vacuum-sealed in cleanroom conditions, protected with foam and desiccants, and labeled for full traceability. Export-grade cartons or wooden crates ensure safe and contamination-free delivery worldwide.

Conclusion

The Tantalum sputtering target combines high purity, excellent corrosion resistance, and reliable film-forming characteristics, making it essential for high-end semiconductor and optical applications. Its superior performance in harsh environments ensures stability and longevity in both industrial and research settings.

For detailed specifications and quotations, please contact us at [sales@thinfilmmaterials.com].

Order Now

Tantalum 99.99%, Diameter 50.8*Height 2.5mm (+/-0.1mm), Tantalum 99.99%, Diameter 50.8*Height 5mm (+/-0.1mm) ), Tantalum 99.99%, Diameter 101*Height 6mm (+/-0.1mm), Ta Target 3N5 ø2"×4mm, Ta target 4N ø101.6×6.35mm with Keeper, Ta target 99.95% Ø3"×3 mm, Bonded to 3 mm Cu BP

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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