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VD0583 Terbium Evaporation Materials, Tb

Catalog No.VD0583
MaterialTerbium (Tb)
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

TFM is a premier manufacturer and supplier of high-purity Terbium evaporation materials, along with a diverse selection of other evaporation materials. We provide these materials in both powder and granule forms, and we can also accommodate custom form requests as needed.

MSDS File

Terbium Evaporation Materials Description

Terbium is a rare earth element known for its silvery-gray color, malleability, softness, and ductility, to the point that it can be sliced with a knife. Although it is relatively stable in air, terbium does not occur naturally in its free form. Instead, it is commonly found in minerals like cerite, gadolinite, and euxenite. Terbium compounds are renowned for their strong fluorescence and are often utilized to create green phosphors.

High-purity terbium evaporation materials are essential for achieving superior film quality in various deposition processes. TFM specializes in providing terbium evaporation materials with purity levels up to 99.99%, ensuring product reliability through rigorous quality control measures.

Terbium Evaporation Materials Specification

Material TypeTerbium
SymbolTb
Atomic Weight158.92535
Atomic Number65
Color/AppearanceSilvery White, Metallic
Melting Point1,356 °C
Theoretical Density8.27 g/cc
SynonymsTerbium Pellets, Terbium Pieces, Terbium Evaporation Pellet, Tb Pellets, Tb Pieces, Tb Evaporation Pellet

Terbium Evaporation Materials Application

  • Deposition Processes: Used in semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Applied in wear protection, decorative coatings, and displays.

Terbium Evaporation Materials Packaging

Our terbium evaporation materials are handled with care to avoid damage during storage and transportation, preserving their quality in original condition.

Contact Us

TFM offers terbium evaporation materials in a variety of forms, purities, sizes, and price ranges. We are committed to producing high-purity e-beam evaporation materials with optimal density and minimal average grain sizes. For current pricing on evaporation pellets and other deposition materials not listed, please reach out to us with your inquiry.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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