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ST0050A Terbium Ferrite Sputtering Targets (Tb3Fe5O12)

MSDS File
Material TypeTerbium Ferrite
SymbolTb3Fe5O12
Color/AppearanceVarious colors, Solid
Melting Point (°C)N/A
Theoretical Density (g/cc)N/A
Water SolubilityInsoluble
SputterRF, RF-R, DC
Type of BondIndium, Elastomer

Terbium Ferrite Sputtering Targets

TFM offers high-quality Terbium Ferrite Sputtering Targets (Tb₃Fe₅O₁₂), designed for thin-film deposition in various advanced applications, such as ferroelectrics, gate dielectrics, and CMOS technologies. Known for their exceptional Faraday effect properties, Terbium Ferrite materials are used in magneto-optic devices and data storage applications.

Key Features and Advantages

  • Purity: 99.9% – Ensures high-performance thin-film deposition, ideal for electronic and optical applications.

  • Custom Sizes Available – Tailored to meet specific requirements for research and industrial applications, ensuring versatility.

  • Superior Magnetic Properties – Offers magneto-optic behavior, beneficial in applications requiring high magnetic sensitivity.

  • Excellent Faraday Effect – The orientation dependence and field behavior at low temperatures make these targets unique in magneto-optical systems.

  • Stable Hysteresis Loop – Features minimal asymmetry near the compensation point for consistent device performance.

  • Durable & Reliable – Cold pressed, sintered, and elastomer bonded to a backing plate, ensuring consistent deposition performance in high-demand applications.

Specifications

  • Circular Targets:

    • Diameter ≤ 14 inches

    • Thickness ≥ 1mm

  • Block Targets:

    • Length ≤ 32 inches

    • Width ≤ 12 inches

    • Thickness ≥ 1mm

Applications

  • Ferroelectrics – Used in memory devices, capacitors, and actuators due to their excellent magnetic properties.

  • Gate Dielectric for CMOS – Ideal for CMOS technology, enabling high-efficiency gate dielectric layers.

  • Magneto-Optic Devices – Applied in data storage, optical switches, and sensor technologies.

  • Thin-Film Deposition – Used in advanced thin films for spintronic devices, optical coatings, and microwave devices.

Manufacturing Process

  • Manufacturing: Cold pressed and sintered to ensure high-density targets that meet stringent performance standards.

  • Bonding: Elastomer bonded to a backing plate for durability and ease of handling during sputtering.

  • Cleaning & Final Packaging: Thoroughly cleaned for vacuum applications and packaged to ensure protection from environmental contaminants during shipment.

Options

  • Custom Sizes Available – Targets can be made to fit specific customer requirements.

  • R&D Purposes – Smaller sizes are offered for research and development applications.

  • Sputtering Target Bonding Service – Enhance target performance and reliability with our sputtering target bonding service.

Industry Impact

TFM’s Terbium Ferrite Sputtering Targets provide a critical material for advanced semiconductor, optical, and ferroelectric applications. With high purity, outstanding magneto-optic properties, and customizable sizes, they are the preferred choice for industries that rely on high-performance thin films, such as data storage, CMOS manufacturing, and spintronic technology.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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