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Terbium Iron Garnet Sputtering Target, TbIG

Terbium Iron Garnet Sputtering Target (TbIG)

Introduction

Terbium Iron Garnet (Tb₃Fe₅O₁₂, commonly abbreviated as TbIG) is a highly specialized sputtering target material valued for its unique magneto-optical and magnetic properties. TbIG thin films are widely used in advanced research and technology fields where precise optical isolation, signal modulation, and spintronic functionalities are required.

Detailed Description

The Terbium Iron Garnet Sputtering Target is a ceramic oxide target synthesized from high-purity terbium and iron precursors. TbIG exhibits strong Faraday rotation, low optical absorption, and excellent thermal stability, making it an indispensable material for magneto-optical devices. The target is available in standard and custom dimensions (discs, rectangular plates, or step targets) to fit various magnetron sputtering systems. Typical purities range from 99.9% to 99.99%, ensuring high-quality thin films with uniform microstructure and reliable performance.

The crystalline garnet structure provides high stability and reproducibility, while bonding options such as indium, copper, or titanium backplates are offered to enhance heat dissipation during deposition.

Applications

Terbium Iron Garnet Sputtering Targets are widely used in:

  • Magneto-optical devices such as isolators and circulators in fiber-optic communication systems

  • Optical data storage and memory devices

  • Spintronic research and next-generation quantum materials

  • Integrated photonics requiring non-reciprocal light propagation

  • Thin-film coatings in R&D labs for optical and electronic devices

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% – 99.99%High purity improves optical clarity and magnetic response
Diameter25 – 150 mm (customizable)Matches different sputtering system requirements
Thickness3 – 6 mmControls sputtering rate and target lifetime
Backing PlateCopper / Titanium / IndiumEnhances thermal conductivity and mechanical stability

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Terbium Iron Garnet (TbIG)Strong Faraday rotation, low absorptionMagneto-optical isolators
Yttrium Iron Garnet (YIG)Low microwave lossesMicrowave and spintronic devices
Bismuth Iron Garnet (BIG)High magneto-optical sensitivityOptical sensing, photonics

FAQ

QuestionAnswer
Can the TbIG target be customized?Yes, dimensions, purity, and backing can be tailored to customer requirements.
How is the target packaged?Vacuum-sealed with protective cushioning, shipped in export-compliant cartons or wooden crates.
Which industries use TbIG the most?Optical communications, spintronics, photonics, and advanced research laboratories.
Does TbIG require special sputtering conditions?Yes, it typically requires oxygen partial pressure control to maintain stoichiometry during deposition.
What shapes are available?Discs, rectangular plates, and step targets are common; custom geometries can also be supplied.

Packaging

Each Terbium Iron Garnet Sputtering Target is securely packaged with vacuum sealing, moisture-proof layers, and foam cushioning to prevent contamination or damage. Labels with product details ensure easy identification and traceability.

Conclusion

The Terbium Iron Garnet Sputtering Target is a critical material for magneto-optical and spintronic device fabrication. With its high purity, strong Faraday effect, and stable garnet structure, it supports high-performance thin-film deposition in both research and industry.

For detailed specifications and a quotation, please contact us at [sales@thinfilmmaterials.com].

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TbIG target 3N ø2"×0.5mm Indium Bonded 2mm Cu BP Total<2.5mm

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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