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Terbium Oxide Sputtering Target, Tb4O7

Chemical Formula: Tb4O7
Catalog Number: TFM-SPT-0585
CAS Number: 12036-41-8
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Terbium Oxide  sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Product Overview

Terbium Oxide Sputtering Target (Tb4O7) is a ceramic sputtering target used to deposit composition-specific oxide thin films. Compared with metallic targets, oxide targets are typically more sensitive to density, porosity, brittleness, thermal shock, and bonding design. In practice, target microstructure, thickness, cooling conditions, and the chosen sputtering mode can all affect arc stability, particle generation, and deposited-film performance.

Material and Deposition Characteristics

RF magnetron sputtering is commonly considered for insulating or semiconducting oxide targets, while sufficiently conductive formulations may allow alternative power modes in some systems. Target density and microstructural uniformity matter because pores, cracks, and local inhomogeneities can contribute to unstable plasma, particles, or target damage. For brittle ceramics, bonded assemblies and gradual power ramping are often worth evaluating.

Technical Data

ParameterTypical Value / RangeImportance
Purity99.9% – 99.99%Higher purity improves film optical and magnetic performance
Density≥95% theoreticalEnsures stable sputtering and uniform deposition
Diameter25 – 300 mm (custom)Compatible with various sputtering cathodes
Thickness3 – 6 mmInfluences sputtering rate and target lifetime
BondingCopper backing plate (optional)Improves heat transfer and mechanical stability
MaterialKey AdvantageTypical Application
Terbium Oxide (Tb₄O₇)Strong magneto-optical and luminescent propertiesMagneto-optical devices and photonics
Yttrium Oxide (Y₂O₃)Excellent dielectric and optical propertiesProtective and optical coatings
Europium Oxide (Eu₂O₃)Strong luminescent characteristicsDisplay technologies and phosphors
QuestionAnswer
Can Tb₄O₇ sputtering targets be customized?Yes, diameter, thickness, purity, and backing plate bonding can all be customized according to sputtering system requirements.
Which sputtering method is recommended for Tb₄O₇ targets?RF magnetron sputtering is commonly used because Tb₄O₇ is an insulating ceramic oxide.
Are bonded targets available?Yes, Tb₄O₇ targets can be indium-bonded or elastomer-bonded to copper backing plates to improve heat dissipation.
What substrates are compatible with Tb₄O₇ thin films?Silicon wafers, sapphire, glass, quartz, and oxide substrates are commonly used.
Which industries commonly use Tb₄O₇ sputtering targets?Photonics research, semiconductor manufacturing, optical coatings, and advanced materials R&D.

Typical Thin-Film Applications

  • Dielectric, insulating, optical, magnetic, protective, or functional ceramic thin films
  • Semiconductor, sensor, photonic, and multilayer coating research
  • Applications where oxide composition, density, and process stability affect film performance

Target Configuration and Ordering Considerations

When requesting a quotation, provide target diameter or rectangular dimensions, thickness, purity or composition, required quantity, and whether a backing plate or bonded assembly is needed. For brittle ceramic or compound targets, it is useful to specify the cathode model, backing-plate material, preferred bonding method, operating power if known, and any density, tolerance, or inspection-document requirements. TFM can review drawings, old-target photos, and application details when custom dimensions are required.

Frequently Asked Questions

Is Terbium Oxide better suited to RF or DC sputtering?

RF magnetron sputtering is commonly considered for insulating or semiconducting oxide targets. If a specific formulation is sufficiently conductive, other modes may also be possible, but the equipment and target properties should be confirmed.

Why is density important for a Terbium Oxide target?

Density and microstructural uniformity affect erosion stability, thermal behavior, and particle risk. Pores, cracks, or local density variations can contribute to unstable sputtering and target damage.

Should a Terbium Oxide target be bonded to a backing plate?

Bonding is often useful for brittle oxide targets because it can improve mechanical support and heat transfer. The backing material and bonding method should be chosen according to target size, thickness, and operating conditions.

Will the deposited film always have the same composition as Tb4O7?

Not always. Film composition can be affected by preferential sputtering, reactive gas, substrate temperature, re-sputtering, and chamber conditions. Composition-sensitive films should be verified after deposition.

How should power be ramped on a brittle Terbium Oxide target?

A conservative power ramp and stable cooling are generally advisable. The exact operating procedure should follow the target size, bonding condition, cathode design, and supplier recommendations rather than a universal wattage.

What information should I provide when ordering Terbium Oxide?

Provide formula or composition, purity, dimensions, quantity, backing and bonding requirements, cathode model or drawing, and any density, tolerance, or inspection requirements.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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