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VD0584 Thulium Evaporation Materials, Tm

Catalog No.VD0584
MaterialThulium (Tm)
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

TFM is a leading manufacturer and supplier of high-purity thulium evaporation materials, along with a diverse range of other evaporation materials. We provide these materials in both powder and granule forms, and we also offer custom forms upon request.

MSDS File

Thulium Evaporation Materials Description

Thulium is a silver-white metal with the symbol Tm. It is both ductile and soft, and can be easily cut with a knife. With a presence of just 2 parts per 100,000 in the Earth’s crust, thulium is the rarest of the rare earth elements. It finds applications in various fields, including high-intensity power generation light sources, lasers, and high-temperature superconductors.

High-purity thulium evaporation materials are crucial for achieving superior film quality in deposition processes. TFM specializes in producing thulium evaporation materials with purity levels up to 99.99%, employing stringent quality assurance measures to ensure product reliability.

Thulium Evaporation Materials Specification

Material TypeThulium
SymbolTm
Color/AppearanceSilvery White, Metallic
Melting Point1,545 °C
Density9.32 g/cc
Thermal Conductivity0.169 W/cm/K
SynonymsThulium Pellets, Thulium Pieces, Thulium Evaporation Pellet, Tm Pellets, Tm Pieces, Tm Evaporation Pellet

Thulium Evaporation Materials Application

  • Deposition Processes: Utilized in semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Applied in wear protection, decorative coatings, and displays.

Thulium Evaporation Materials Packaging

Our thulium evaporation materials are handled with care to prevent damage during storage and transportation, ensuring the products maintain their original quality.

Contact Us

TFM offers thulium evaporation materials in a variety of forms, purities, sizes, and price ranges. We are dedicated to producing high-purity e-beam evaporation materials with optimal density and minimal average grain sizes. For current pricing on evaporation pellets and other deposition materials not listed, please contact us with your inquiry.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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