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Thulium Iron Garnet Sputtering Target

Thulium Iron Garnet Sputtering Target | Tm₃Fe₅O₁₂ Ceramic Target for Thin Film Deposition

The Thulium Iron Garnet (Tm₃Fe₅O₁₂) Sputtering Target from TFM is engineered for precision deposition in high-performance magneto-optical and photonic devices. This advanced ceramic material exhibits outstanding Faraday rotation, low optical absorption, and excellent thermal stability—making it ideal for thin films used in optical isolators, circulators, waveguides, and spintronic components.

Manufactured using high-purity precursors and optimized sintering processes, TFM’s Thulium Iron Garnet sputtering targets deliver high density, uniform grain structure, and excellent film-forming characteristics in both RF and DC magnetron sputtering systems.

Product Details:

  • Chemical Formula: Tm₃Fe₅O₁₂

  • Purity: ≥99.9% (3N+)

  • Form: Ceramic, high-density target

  • Crystal Structure: Cubic garnet

  • Standard Sizes: 1″, 2″, 3″, 4″ diameter; 0.125″ or 0.250″ thick

  • Bonding Options: Indium bonding to copper backing plates available upon request

  • Surface Finish: Fine-polished, ready for deposition

Key Features:

  • High Faraday rotation for non-reciprocal optical devices

  • Low optical loss and high transparency in the near-IR to visible range

  • Stable under high-temperature sputtering environments

  • Compatible with RF sputtering systems

Applications:

  • Optical isolators and circulators in fiber optic systems

  • Magneto-optical data storage and recording media

  • Spintronic and magneto-optical sensors

  • Research in integrated photonics and quantum optics

Packaging:

Each target is individually packaged in a vacuum-sealed cleanroom pouch with ESD protection and foam padding, ensuring it arrives contamination-free and ready for immediate use.

Ordering & Customization:

TFM supports custom dimensions, bonding configurations, and dopant modifications based on your research or production needs. Contact our technical team for guidance on selecting the right Thulium Iron Garnet target for your deposition system.

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TmIG Target 99.99% Mono-Phase ø50.8*3.18mm, TmIG Target 99.99% ø50.8×3.18mm

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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