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Thulium(III) Oxide Evaporation Materials

VD0732 Thulium(III) Oxide Evaporation Materials, Tm2O3

Catalog No.VD0732
MaterialThulium Oxide (Tm2O3)
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

At TFM, we pride ourselves on being a top manufacturer and supplier of high-purity thulium(III) oxide evaporation materials, along with a diverse range of other evaporation materials. We provide our products in both powder and granule forms to suit various needs. Additionally, we offer customized options to meet specific requirements upon request.

MSDS File

Thulium(III) Oxide Evaporation Materials

Introduction

Thulium(III) Oxide (Tm₂O₃) Evaporation Materials are high-purity rare-earth oxides designed for thin film deposition in optical, electronic, and photonic applications. Known for its unique optical properties in the near-infrared range, Tm₂O₃ is widely used to produce specialized coatings for lasers, optical communication devices, and advanced research applications. Its stable crystalline structure and low volatility make it an excellent choice for electron beam (e-beam) evaporation and thermal evaporation processes.

Detailed Description

Thulium(III) Oxide is typically supplied in granular, pellet, or tablet form to suit different evaporation systems. Produced from refined high-purity raw materials, these evaporation materials exhibit minimal impurities, ensuring stable evaporation rates and reproducible thin film performance.

  • Chemical Formula: Tm₂O₃

  • Purity: 99.9% – 99.99% (3N–4N) to minimize film contamination.

  • Appearance: Pale green or white crystalline solid.

  • Forms: Pellets, tablets, or pieces for compatibility with various evaporation sources (boats, crucibles).

  • Stability: Excellent thermal stability and controlled evaporation behavior under vacuum conditions.

Applications

Thulium(III) Oxide evaporation materials are employed across diverse industries and R&D fields:

  • Optical Coatings – Infrared transmission coatings, filters, and beam splitters.

  • Laser Technology – Active medium coatings for solid-state and fiber lasers.

  • Telecommunications – Coatings for optical communication components.

  • Energy & Electronics – Functional layers in advanced devices and thin film research.

  • R&D – Material science studies, particularly for rare-earth-based functional oxides.

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% – 99.99%High purity ensures minimal defect formation in thin films
Particle/Form SizePellets/Tablets (2–6 mm)Provides uniform evaporation and stable rates
Evaporation MethodE-beam / ThermalCompatible with multiple deposition systems
AppearancePale green/white solidRare-earth oxide characteristic

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Thulium(III) Oxide (Tm₂O₃)Infrared optical propertiesIR coatings, lasers
Erbium Oxide (Er₂O₃)Strong absorption at 1.5 µmTelecom coatings
Ytterbium Oxide (Yb₂O₃)High NIR transmissionOptical windows, energy devices

FAQ

QuestionAnswer
What forms are available?Pellets, tablets, granules, or custom sizes upon request.
What is the typical lead time?Usually 1–2 weeks depending on order volume and customization.
Can it be used in e-beam evaporation?Yes, Tm₂O₃ is stable and well-suited for e-beam systems.
How is it packaged?Vacuum-sealed in clean containers, cushioned with protective foam, and shipped in export-safe cartons.
Which industries use it most?Optics, lasers, telecommunications, and advanced R&D laboratories.

Packaging

Thulium(III) Oxide Evaporation Materials are carefully packaged in vacuum-sealed containers to prevent contamination or moisture absorption. Each container is externally labeled for traceability, and the materials are shipped in foam-protected, export-compliant cartons to ensure safe delivery.

Conclusion

Thulium(III) Oxide (Tm₂O₃) Evaporation Materials provide high stability, excellent purity, and unique optical properties, making them essential for thin film coatings in infrared optics, laser systems, and communication technologies. With customizable forms and reliable deposition performance, they are a trusted choice for research and industry alike.

For detailed specifications and a quotation, please contact us at [sales@thinfilmmaterials.com].

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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