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ST0943 Tin Antimonide Sputtering Target, SnSb

Chemical FormulaSnSb
Catalog No.ST0943
CAS Number28980-49-6
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Tin Antimonide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Tin Antimonide Sputtering Target Description

Tin Antimonide Sputtering Targets provided by TFM can be used in thin film deposition techniques such as Physical Vapor Deposition (PVD) and Magnetron Sputtering due to their very high purity and excellent quality, resulting in films with superior properties. Their good electrical conductivity makes them widely used in electronic devices. Additionally, they can be used to prepare semiconductor films for various electronic and optoelectronic applications. Tin Antimonide Sputtering Targets also possess magnetic properties, which contribute to their role in magnetic storage media.

Related Product: Tin Zinc Sputtering Target, Indium Tin Sputtering Target

Tin Antimonide Sputtering Target Specifications

Compound FormulaSnSb
Molecular Weight240.47
AppearanceGrey Target
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Tin Antimonide Sputtering Target Handling Notes

Indium bonding is recommended for Tin Antimonide Sputtering Targets due to some of its characteristics that make it less suitable for sputtering, such as brittleness and low thermal conductivity. These factors make the material susceptible to thermal shock, and indium bonding helps to mitigate these issues, ensuring better performance and stability during the sputtering process.

Tin Antimonide Sputtering Target Application

Tin Antimonide Sputtering Targets offer a range of applications across various fields due to their unique properties:

  1. Thermoelectric Materials: Tin Antimonide Sputtering Targets have potential applications in thermoelectric materials, which are used to convert thermal energy into electrical energy or vice versa. This is particularly useful in energy harvesting and thermoelectric power generation, where efficient thermal management is crucial.
  2. Semiconductor Films: Tin Antimonide Sputtering Targets can be used to prepare semiconductor films that may find applications in electronic and optoelectronic devices, such as thin-film transistors, photovoltaic cells, and other semiconductor technologies.
  3. Conductive Films: Films deposited from Tin Antimonide Sputtering Targets often possess good electrical conductivity, making them suitable for applications requiring conductive surfaces, such as conductive films, conductive glass, and other electronic components.
  4. Magnetic Materials: The magnetic properties of Tin Antimonide Sputtering Targets allow them to be utilized in the preparation of magnetic materials. These could be used in magnetic storage media and other applications that require magnetic functionality.
  5. Thermal Management: Tin Antimonide Sputtering Targets can be applied in thermal management systems, such as the preparation of thin films with good thermal conductivity. These films are ideal for use in heat sinks and other devices that require efficient heat dissipation.
  6. Research and Development: Tin Antimonide Sputtering Targets are valuable tools for research and development, especially in the exploration of new material properties and potential applications. This makes them essential in laboratory settings and academic research, where innovation in material science is a key focus.

Tin Antimonide Sputtering Target Packaging

Our Tin Antimonide Sputtering Target is meticulously handled during storage and transportation to ensure that the quality of our products is preserved in their original condition. This careful management helps maintain the high purity and excellent performance characteristics of the material, ensuring that it meets the stringent requirements of your applications.

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TFM offers Tin Antimonide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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