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ST0479 Tin (IV) Sulfide Sputtering Target, SnS2

Chemical Formula: SnS2
Catalog Number: ST0479
CAS Number: 1315-01-1
Purity: 99.95%-99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Tin (IV) Sulfide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Tin (IV) Sulfide Sputtering Target Description

Tin (IV) Sulfide Sputtering Target consists of tin and sulfur. High-purity Tin (IV) Sulfide sputter targets are crucial for deposition processes, ensuring the production of high-quality films. TFM specializes in manufacturing sputtering targets with purity levels up to 99.9995%, employing stringent quality assurance measures to ensure product reliability.

Related products: Tin Sputtering Target

Tin (IV) Sulfide Sputtering Target Specification

Material Type Tin (IV) Sulfide
Symbol SnS2
Color/Appearance Dark Brown Solid
Melting Point 882 °C
Density 5.22 g/cm3
Available Sizes Dia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

Tin (IV) Sulfide Sputtering Target Application

Tin (IV) Sulfide Sputtering Target is used in thin film deposition, decoration, semiconductors, displays, LEDs, and photovoltaic devices. It also plays a role in functional coatings, optical information storage, glass coatings (including automotive and architectural glass), and optical communication applications.

Tin (IV) Sulfide Sputtering Target Packing

Our Tin (IV) Sulfide Sputtering Targets are clearly tagged and labeled for efficient identification and quality control. We take great care to prevent any damage during storage and transportation, ensuring that the products remain in optimal condition.

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TFM offers Tin (IV) Sulfide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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