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ST0052 Tin Sputtering Target, Sn

Chemical Formula: Sn
Catalog Number: ST0052
CAS Number: 7440-31-5
Purity: 99.9%, 99.95%, 99.99%, 99.995%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Tin sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Tin Sputtering Target Description

Tin

The tin sputtering target, composed of high-purity tin metal with a silvery, lustrous gray appearance, is crucial for thin film deposition processes. Tin, known historically as stannum, dates back to 3500 BC and is represented by the chemical symbol “Sn.” It is a p-block element in Period 5 and Group 14 of the periodic table with an atomic number of 50. The high-quality tin sputtering target boasts a relative atomic mass of 118.710(7) Daltons and is essential in numerous industrial applications.

Tin Sputtering Target Specification

Material Type Tin
Symbol Sn
Color/Appearance Silvery Lustrous Gray, Metallic
Melting Point 232 °C
Density 7.28 g/cc
Thermal Conductivity 66.6 W/m.K
Coefficient of Thermal Expansion 22 x 10-6/K
Available Sizes Dia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Tin Sputtering Target Application

Tin sputtering targets are essential in the thin film deposition process and are widely used across various industries, including fuel cells, semiconductor production, displays, LED and photovoltaic devices, and glass coating. Tin also serves to coat other metals to prevent corrosion and is vital in several tin alloys such as soft solder, pewter, bronze, and phosphor bronze. These alloys possess unique properties that make them ideal for various applications. For instance, the niobium-tin alloy is crucial in the production of superconducting magnets.

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TFM offers thulium Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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