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VD0869 Tin Telluride Evaporation Materials, SnTe

Catalog No.VD0869
MaterialTin Telluride (SnTe)
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

TFM stands at the forefront of manufacturing and supplying top-tier high-purity tin telluride evaporation materials. Our extensive range includes various evaporation materials available in both powder and granule forms. For those with specific needs, we also offer customized forms upon request.

MSDS File

Tin Telluride Evaporation Materials Overview

Tin telluride evaporation materials from TFM are high-quality ceramic compounds with the chemical formula SnTe. These materials are essential for high-precision deposition processes, ensuring superior quality in the deposited films. TFM is dedicated to producing evaporation materials with up to 99.9995% purity, leveraging rigorous quality assurance practices to ensure exceptional product reliability.

Specifications of Tin Telluride Evaporation Materials

Material TypeTin Telluride
SymbolSnTe
Appearance/ColorGray cubic crystals
Melting Point790 °C (1,450 °F; 1,060 K)
Density6.445 g/cm3
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

Applications of Tin Telluride Evaporation Materials

These evaporation materials are crucial for various deposition processes, including semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD). They are primarily used in optics for applications such as wear protection, decorative coatings, and displays.

Packaging and Handling

Our tin telluride evaporation materials are securely packaged in plastic vacuum bags to prevent damage and maintain the product’s quality during storage and transport. Each package includes a Certificate of Analysis (COA) for the raw material.

Contact Us

TFM excels in producing high-purity tin telluride evaporation materials tailored for semiconductors, CVD, PVD, and optical applications. Our integrated approach combines engineering expertise, advanced manufacturing, and comprehensive analytical support to deliver top-tier evaporation materials. Reach out today for more information or to make an inquiry.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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