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VD0649 Titanium Aluminum Evaporation Materials, Ti/Al

Catalog No.VD0649
MaterialTitanium Aluminum (Ti/Al)
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

TFM is a top manufacturer and supplier of high-purity titanium aluminum evaporation materials, along with a broad range of other evaporation substances. Our titanium aluminum materials are available in both powder and granule forms, and we also provide custom options tailored to specific needs.

MSDS File

Titanium Aluminum Evaporation Materials Overview

Titanium aluminum evaporation materials, produced by TFM, are high-purity alloys comprising titanium (Ti) and aluminum (Al). These materials are essential for advanced deposition techniques, ensuring the formation of high-quality, thin films. TFM is known for its precision manufacturing, delivering evaporation materials with a purity of up to 99.9995%. This high standard is maintained through rigorous quality assurance processes.

Applications of Titanium Aluminum Evaporation Materials

These evaporation materials are utilized in various fields:

  • Deposition Processes: Essential for semiconductor fabrication, chemical vapor deposition (CVD), and physical vapor deposition (PVD) methods.
  • Optical Coatings: Applied in wear-resistant coatings, decorative finishes, and display technologies.

Packaging and Handling

TFM ensures that titanium aluminum evaporation materials are meticulously tagged and labeled to facilitate easy identification and quality control. Special care is taken in packaging to prevent damage during storage and transport.

Contact Us

As a premier supplier, TFM offers titanium aluminum evaporation materials in various forms, including tablets, granules, rods, and wires. Custom shapes and quantities can be arranged upon request. In addition, TFM provides a range of related products such as evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and inquiries about materials not listed, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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