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ST0887 Titanium Aluminum Silicon Sputtering Target, Ti/Al/Si

Titanium Aluminum Silicon sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

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Titanium Aluminum Silicon Sputtering Target Description

Titanium Aluminum Silicon Sputtering Target is a specialized material used in sputtering deposition processes. Sputtering is a technique for depositing thin films onto substrate surfaces, essential in various applications such as electronics, optics, and thin-film solar cells.

The TiAlSi sputtering target consists of titanium, aluminum, and silicon, each contributing valuable properties:

  • Titanium: Provides high strength, excellent corrosion resistance, and bio-compatibility.
  • Aluminum: Offers high electrical and thermal conductivity, combined with lightweight characteristics.
  • Silicon: Delivers superior semiconductor properties, making it ideal for integrated circuits and solar cells.

This combination of elements ensures that the sputtering target is well-suited for a wide range of advanced technological applications.

Titanium Aluminum Silicon Sputtering Target Specifications

Compound FormulaTi/Al/Si
AppearanceSilvery-gray metallic target
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Titanium Aluminum Silicon Sputtering Target Handling Notes

Titanium Aluminum Silicon Sputtering Target is used in sputtering deposition processes for applications in electronics, optics, and thin-film solar cells. This target combines titanium, aluminum, and silicon, each offering specific benefits:

  • Titanium: Known for high strength, corrosion resistance, and bio-compatibility.
  • Aluminum: Provides excellent electrical and thermal conductivity, with lightweight properties.
  • Silicon: Features superior semiconductor characteristics, ideal for integrated circuits and solar cells.

Due to some inherent characteristics such as brittleness and low thermal conductivity, this material can be susceptible to thermal shock. Therefore, Indium bonding is recommended for Titanium Aluminum Silicon sputtering targets. Indium bonding helps mitigate these issues by improving adhesion and providing better thermal management.

Titanium Aluminum Silicon Sputtering Target Application

Titanium Aluminum Silicon Sputtering Targets are essential in several high-tech applications:

  • Coating Devices: They are used to deposit durable and high-performance coatings on a variety of devices, enhancing their functionality and longevity.
  • Optical Coatings: These targets are employed to produce thin films with tailored optical properties, such as anti-reflective or reflective coatings, crucial for optical components.
  • Microelectronics: In microelectronics, they facilitate the deposition of thin films in semiconductor devices, improving performance and integration in electronic circuits.
  • Photovoltaics: They play a role in the fabrication of photovoltaic cells, contributing to the efficiency and effectiveness of solar energy conversion.

The ability to adjust the composition of these targets allows for the creation of thin films with precise characteristics suited to specific applications.

Titanium Aluminum Silicon Sputtering Target Packaging

Our Titanium Aluminum Silicon Sputtering Targets are meticulously handled throughout storage and transportation to ensure they remain in pristine condition, preserving their quality and performance.

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TFM offers Titanium Aluminum Silicon Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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