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titanium-carbide

VD0768 Titanium Carbide Evaporation Materials, TiC

Catalog No.VD0768
MaterialTitanium Carbide (TiC)
Purity99.5%
ShapePowder/ Granule/ Custom-made

TFM stands out as a premier producer and supplier of high-purity Titanium Carbide evaporation materials. Our extensive range includes various evaporation materials available in both powder and granule forms. For those with specific needs, we also provide customized options to suit individual requirements.

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Titanium Carbide Evaporation Materials Overview

TFM offers high-purity Titanium Carbide (TiC) evaporation materials, essential for high-quality deposition processes. Titanium Carbide, with the chemical formula TiC, is a carbide ceramic known for its exceptional performance in producing top-tier deposited films. Our TiC evaporation materials are produced to an impressive purity of up to 99.9995%, thanks to rigorous quality assurance protocols that ensure reliability.

Related Products

  • Titanium Evaporation Materials
  • Carbide Ceramic Evaporation Materials

Titanium Carbide Evaporation Materials Specification

Material TypeTitanium Carbide
SymbolTiC
Appearance/ColorBlack Solid
Melting Point3,160 °C (5,720 °F; 3,430 K)
Density4.93 g/cm3
Purity99.5%
ShapePowder/ Granule/ Custom-made

Applications

Titanium Carbide evaporation materials are versatile and used in:

  • Deposition Processes: Ideal for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Suitable for wear protection, decorative coatings, and displays.

Packaging and Handling

Our Titanium Carbide evaporation materials are meticulously tagged and labeled to facilitate efficient identification and maintain quality control. We ensure that packaging prevents any damage during storage and transportation.

Contact Us

As a leading provider of high-purity Titanium Carbide evaporation materials, TFM offers various shapes including tablets, granules, rods, and wires. Customized forms and quantities are available on request. We also supply evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and to inquire about materials not listed, please reach out to us.

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Titanium Carbide Granules, TiC-99.9%, 1~8mm, 100g, Titanium Carbide Granules, TiC-99.9%, 1~8mm, 500g

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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