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Titanium Dioxide Sputtering Target

ST0197 Titanium Dioxide Sputtering Target, TiO2

Chemical Formula: TiO2
Catalog Number: ST0197
CAS Number: 13463-67-7
Purity: >99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

 Titanium Oxide  sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Titanium Dioxide Sputtering Target Description

titanium dioxide structure
TiO2 Sputtering Target Structure

Titanium Dioxide Sputtering Target Overview

The Titanium Dioxide Sputtering Target from TFM is composed of titanium (Ti) and oxygen (O), with the chemical formula TiO2. Known as titanium(IV) oxide or titania, TiO2 naturally occurs as the minerals rutile, anatase, and in high-pressure forms such as akaogiite and brookite. Akaogiite, a monoclinic baddeleyite-like form, and brookite, an orthorhombic α-PbO2-like form, are both found at the Ries crater in Bavaria.

Sourcing and Characteristics

Titanium dioxide is primarily sourced from ilmenite ore, the most prevalent titanium dioxide-bearing ore globally. Rutile, the second most abundant form, contains approximately 98% titanium dioxide. The anatase and brookite phases are metastable and will irreversibly transform into the stable rutile phase when heated to temperatures between 600–800 °C (1,112–1,472 °F). This transformation is crucial for applications requiring the specific properties of the rutile phase, such as high refractive index and excellent UV resistance.

Titanium Dioxide Sputtering Target Specification

Material TypeTitanium (IV) Oxide
SymbolTiO2
Color/AppearanceWhite-Beige, Gray-Black
Theoretical Density 4.23 g/cc
Melting Point1,830 °C
SputterRF, RF-R
Type of BondIndium, Elastomer
CommentsSuboxide, must be reoxidized to rutile. Ta reduces TiO2 to TiO and Ti.
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Titanium Dioxide Sputtering Target Application

  • Thin Film Coating: Titanium dioxide (TiO2) sputtering targets are widely used for thin film deposition in various applications, including fuel cells, decorative coatings, semiconductors, displays, LEDs, photovoltaic devices, and glass coatings. Due to its high refractive index, TiO2 is particularly valuable in thin-film optics, enhancing the efficiency and performance of optical components.

    Paints and Coatings: TiO2 is a key ingredient in paints and coatings, providing excellent opacity, brightness, and durability. It helps ensure the longevity of painted surfaces by protecting them from environmental factors. Its high refractive index makes it ideal for producing bright and vibrant colors in coatings.

    Plastics, Adhesives, and Rubber: In plastics and rubber products, titanium dioxide helps reduce brittleness, fading, and cracking caused by light exposure. This property extends the life and appearance of these materials, making them more durable and resilient.

    Cosmetics: Titanium dioxide is commonly used in cosmetics, particularly in pigment-grade form. It helps hide blemishes and brighten the skin, allowing for thinner applications of makeup with the same coverage. Known as titanium white, Pigment White 6 (PW6), or CI 77891, it is a popular choice for achieving a natural-looking finish in cosmetic products.

    Paper: In the paper industry, TiO2 is used to coat paper, enhancing its whiteness, brightness, and opacity. This improves the paper’s quality and printability, making it more attractive and functional for various uses.

    Food Contact Materials and Ingredients: Titanium dioxide’s opacity to visible and ultraviolet light makes it an effective protective agent for food, beverages, supplements, and pharmaceuticals. It helps prevent premature degradation, thereby extending the shelf life of these products. Additionally, specific high-purity grades of titanium dioxide are used in drug tablets, capsule coatings, and as a decorative additive in certain foods.

Titanium Dioxide TiO2 Sputtering Target Bonding Services

Specialized bonding services for  titanium oxide Sputtering Targets, including indium and elastomeric bonding techniques, enhance performance and durability. Thin Film Materials (TFM) ensures high-quality solutions that meet industry standards and customer needs.

We also offer custom machining of backing plates, which is essential for sputtering target assembly. This comprehensive approach improves target design flexibility and performance in thin film deposition. Our channels provide detailed information about bonding materials, methods, and services, helping clients make informed decisions.

Titanium Dioxide TiO2 Sputtering Target Packaging

Our titanium oxide sputter targets are meticulously handled to ensure they remain in pristine condition throughout storage and transportation. We take extra precautions to protect these products, preserving their quality and integrity so that they arrive at your facility ready for optimal use.

Get Contact

TFM offers Titanium Oxide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.
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TiO2 Target 4N 150*50*3mm Indium Bonded 3mm Cu B/Plate, TiO2 Target 4N 150*50*6mm Indium Bonded 3mm Cu B/Plate

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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