Product Overview
Titanium Evaporation Materials (Ti) is supplied as a high-purity evaporation source for PVD processes that require refractory metallic thin films. Because refractory metals have high melting temperatures and low vapor pressures, electron-beam evaporation is often more practical than simple resistance heating. Purity, source form, charge size, crucible or hearth compatibility, and the required deposition rate should therefore be considered together when specifying the material.
Evaporation Behavior and Process Considerations
Electron-beam evaporation is commonly considered because it can concentrate heat directly on the charge without requiring the entire source holder to reach the material’s melting temperature. For high-melting metals, stable hearth cooling, charge placement, beam rastering, and conservative initial conditioning help reduce spitting and local overheating. The film deposition rate should be stabilized before opening the substrate shutter.
Technical Data
| Material Type | Titanium |
| Symbol | Ti |
| Color/Appearance | Silvery Metallic |
| Melting Point | 1,660°C |
| Theoretical Density | 4.5(g/cc) |
| Z Ratio | 0.628 |
| Thermal Evaporation Techniques | Tungsten Boat, TiC Crucible |
| Synonyms | Titanium Pellets, Titanium Pieces, Titanium Evaporation Pellet, T iPellets, Ti Pieces, Ti Evaporation Pellet |
Typical Thin-Film Applications
- Refractory metallic films, electrodes, diffusion barriers, and high-temperature device layers
- Semiconductor, sensor, optical, and vacuum-device thin-film structures
- Research requiring dense metallic coatings with high thermal stability
Source Form and Ordering Considerations
For quotation, provide material, purity, source form, particle or piece size, quantity, evaporation method, and any boat, basket, crucible, or e-beam hearth constraints. If the material will be used for a specific coating stack, sharing the intended film thickness or deposition application can help with source-form selection and packaging recommendations.
Frequently Asked Questions
Is Titanium better suited to thermal or e-beam evaporation?
Because refractory metals have high melting temperatures and low vapor pressures, electron-beam evaporation is often the more practical method. The final choice depends on the required rate, charge size, and evaporator design.
What source form is commonly used for Titanium evaporation?
Pieces, pellets, granules, or other compact charge forms can be supplied depending on the e-beam hearth or crucible geometry. The charge should fit securely and heat evenly.
Why is preconditioning important before evaporating Titanium?
Gradual preheating helps remove adsorbed gases, stabilize the charge, and establish a repeatable evaporation rate before the substrate is exposed.
Can Titanium react with the crucible or hearth?
Source compatibility depends on temperature and the chosen holder material. For high-temperature evaporation, the crucible or hearth design should be reviewed to minimize reaction, contamination, or wetting problems.
Does higher purity improve Titanium thin films?
Higher purity can reduce unwanted metallic and nonmetallic contamination in the deposited layer. The required grade should be selected from the film’s contamination limits and device requirements.
What should I provide for a Titanium evaporation-material RFQ?
Provide purity, source form, piece or pellet size, quantity, evaporation method, hearth or crucible constraints, and any film-purity or documentation requirements.

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