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Zinc Fluoride Sputtering Target

ST0255 Titanium Fluoride Sputtering Target, TiF3

Chemical Formula: TiF3
Catalog Number: ST0255
CAS Number: 13470-08-1
Purity: 99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Titanium Fluoride sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Titanium Fluoride Sputtering Target Target

The Titanium Fluoride Sputtering Target is a fluoride ceramic sputtering target composed of titanium and fluorine. It is specifically designed for use in various thin film deposition processes, among other industrial applications.

TitaniumTitanium, represented by the chemical symbol “Ti,” is a chemical element named after the Titans, the powerful deities from Greek mythology. It was first discovered in 1791 by W. Gregor, with its isolation later accomplished and announced by J. Berzelius. Titanium has an atomic number of 22 and is located in Period 4 and Group 4 of the periodic table, within the d-block. The relative atomic mass of titanium is approximately 47.867(1) Dalton, with the number in parentheses indicating the uncertainty of this measurement.

Related Product: Titanium Sputtering Target

FluorineFluorine, also known as fluorin, is a chemical element with the symbol “F.” Its name is derived from the Latin word ‘fluere,’ which means to flow. The element was first noted in 1810 by A.-M. Ampère, with its successful isolation later achieved by H. Moissan. Fluorine has an atomic number of 9 and is situated in Period 2 and Group 17 of the periodic table, falling within the p-block. The relative atomic mass of fluorine is 18.9984032(5) Dalton, with the number in brackets indicating the uncertainty of this measurement.

Titanium Fluoride Sputtering Target Application

The Titanium Fluoride Sputtering Target is widely utilized in various industrial applications. It is primarily used in thin film deposition processes, which are crucial for producing semiconductors, displays, LEDs, and photovoltaic devices. Additionally, it plays a significant role in decorative applications and functional coatings. This target is also used in the optical information storage industry, as well as in the glass coating industry for automotive and architectural glass, and in optical communication technologies.

Titanium Fluoride Sputtering Target Packing

Our Titanium Fluoride Sputter Targets are carefully tagged and labeled externally to ensure efficient identification and maintain rigorous quality control. We take meticulous precautions to prevent any damage during storage or transportation, ensuring the targets arrive in perfect condition.

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TFM offers Titanium Fluoride Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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