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ST0217 Titanium Nitride Sputtering Target, TiN

Chemical Formula: TiN
Catalog Number: ST0217
CAS Number: 25583-20-4
Purity: 99.5%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Titanium Nitride sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Titanium Nitride Sputtering Target Description

TFM is your reliable source for premium titanium nitride (TiN) sputtering targets, composed of a ceramic material containing titanium (Ti) and nitrogen (N). TiN is renowned for its extreme hardness and is widely used as a high-performance coating on various substrates, including titanium alloys, steel, carbide, and aluminum, to enhance their surface properties. Our TiN sputtering targets are specifically engineered for use in thin film deposition processes, providing exceptional uniformity, adhesion, and wear resistance.

Related Product: Titanium Sputtering Target

TitaniumNitrogen

Titanium Nitride Sputtering Target Specification

Material TypeTitanium Nitride
SymbolTiN
Color/AppearanceYellow-Brown, Crystalline Solid
Melting Point2,930° C
Density5.4 g/cm3
Available SizesDia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Titanium Nitride Sputtering Target Application

  • Titanium nitride (TiN) sputtering targets are widely used to create TiN films, known for their excellent hardness and corrosion resistance. These coatings are commonly applied to machine tools like drills and milling cutters, significantly extending their service life, often by more than three times. Due to TiN’s metallic gold appearance, it is also popular for decorative applications, such as coating costume jewelry and automotive trim.In microelectronics, thin films of TiN serve as conductive layers that connect active devices to metal contacts, while also acting as diffusion barriers to prevent metal diffusion into silicon. Additionally, TiN films are utilized as electrodes in bioelectronic applications, such as smart implants and in vivo biosensors, due to their durability and resistance to corrosion from body fluids.

Titanium Nitride Sputtering Target Packing

Our titanium nitride sputter coater targets are meticulously tagged and labeled externally to guarantee efficient identification and quality control. We take great care to ensure that these targets are handled properly, avoiding any damage that might occur during storage or transportation, thus preserving the quality and integrity of our products.

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TFM offers Titanium Nitride Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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