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Titanium(III) Oxide Evaporation Materials

VD0734 Titanium(III) Oxide Evaporation Materials, Ti2O3

Catalog No.VD0734
MaterialTitanium Oxide (Ti2O3)
Purity99.9%
ShapePowder/ Granule/ Custom-made

At TFM, we excel in manufacturing and supplying high-purity titanium(III) oxide evaporation materials, alongside a broad range of other evaporation products. Our titanium(III) oxide materials come in both powder and granule forms, with customized options available to meet specific requirements upon request.

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Titanium(III) Oxide Evaporation Materials Overview

Titanium(III) oxide, with the chemical formula Ti₂O₃, is a high-purity oxide material essential for quality deposition processes. At TFM, we specialize in producing titanium(III) oxide evaporation materials with purities reaching up to 99.9995%. Our rigorous quality assurance ensures that each product meets the highest standards of reliability.

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Specifications of Titanium(III) Oxide Evaporation Materials

Material TypeTitanium(III) Oxide
SymbolTi2O3
Appearance/ColorViolet black solid
Melting Point2,130 °C (3,870 °F; 2,400 K) (decomposes)
Density4.49 g/cm3
Purity99.9%
ShapePowder/ Granule/ Custom-made

Applications of Titanium(III) Oxide Evaporation Materials

Titanium(III) oxide evaporation materials are utilized in various fields, including:

  • Deposition Processes: Essential for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Used in wear protection, decorative coatings, and display technologies.

Packaging Information

Our titanium(III) oxide evaporation materials are carefully tagged and labeled to ensure efficient identification and quality control. We take great care to prevent any damage during storage and transportation.

Contact Us

TFM is a premier manufacturer and supplier of high-purity titanium(III) oxide evaporation materials. We offer various shapes, including tablets, granules, rods, and wires, with custom forms and quantities available upon request. In addition to evaporation materials, we provide evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current prices and inquiries about materials not listed, please contact us today.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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