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Titanium Oxide Rotary Sputtering Target

Titanium Oxide (TiOx) Rotary Sputtering Target

Introduction

TFM offers high-quality Titanium Oxide Rotary Sputtering Target, designed for precise thin-film deposition in various advanced applications, including optical coatings, semiconductor devices, and energy storage solutions. These targets provide outstanding optical transparency, high refractive index, and superior dielectric properties, making them ideal for the production of titanium oxide films used in antireflective coatings, sensors, and photovoltaics.

The rotary sputtering target design ensures uniform and efficient deposition of TiOₓ films across large substrates, promoting consistent quality and high-performance film growth. Titanium oxide films are highly valued for their high thermal stability, chemical resistance, and biocompatibility, making them suitable for a wide range of applications, including solar cells, decorative coatings, and capacitors.

TFM provides customized TiOₓ rotary sputtering targets, with precise control over material composition and purity, ensuring optimal results for your thin-film deposition processes in industries such as electronics, optics, and renewable energy.

Titanium Oxide Rotary Sputtering Target Specifications

MaterialsTitanium Oxide Rotary Sputtering Target
SymbolTiOx (1.7 < x < 1.9)
Purity99.5% – 99.95%
Melting Point (°C)N/A
Production MethodSpraying Type / Bonded Type (Cold isostatic pressing + high-temperature sintering)
Backing TubeTitanium, Stainless Steel
Bonding MaterialIndium or Elastomer
SizeAs per customer’s drawings
Relative Density≥97% (≥4.13 g/cm³)
Resistivity (Ω·cm)≤0.3
Annual Capacity1,000 tons

Applications

  • Thin Film Photovoltaic Solar Industry
  • Semiconductor Electronics Industry
  • Flat Panel Display Industry
  • Construction / Automotive Glass Industry
  • Optical Coating

For more information or to place an order, please contact TFM directly.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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