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Titanium Silicate Sputtering Target

ST0474 Titanium Silicate Sputtering Target, Ti0.44Si0.10O

Chemical Formula: Ti0.44Si0.10O
Catalog Number: ST0474
Purity: 99.9%, 99.99%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Titanium Silicate sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Titanium Silicate Sputtering Target Description

Titanium Silicate Sputtering Target is composed of high-purity titanium, silicon, and oxygen. These targets are crucial in deposition processes to ensure the production of high-quality films. At TFM, we specialize in manufacturing sputtering targets with purities of up to 99.9995%, employing rigorous quality assurance processes to guarantee the reliability and performance of our products.

Related products: Titanium Sputtering Target

Titanium Silicate Sputtering Target Specification

Material Type Titanium Silicate
Symbol Ti0.44Si0.10O
Color/Appearance Solid
Melting Point /
Density /
Type of Bond Elastomer, Indium
Available Sizes Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Titanium Silicate Sputtering Target Application

Titanium Silicate Sputtering Target is used for thin film deposition, decoration, semiconductor applications, displays, LED and photovoltaic devices, and functional coatings. It is also essential in various optical information storage industries, including glass coatings for car glass and architectural glass, as well as optical communication technologies.

Titanium Silicate Sputtering Target Packaging

Our Titanium Silicate Sputter Targets are meticulously handled to prevent damage during storage and transportation, ensuring that the quality of our products remains intact.

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TFM offers Titanium Silicate  Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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