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Titanium Sputtering Target

ST0053 Titanium Sputtering Target, Ti

Chemical Formula: Ti
Catalog Number: ST0053
CAS Number: 7440-32-6
Purity: 99.2%-99.7%, 99.97%-99.98%, >99.99%, 99.995%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Titanium sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

Titanium Sputtering Targets (Ti) are among the most widely used metallic targets in physical vapor deposition (PVD), valued for their excellent adhesion, chemical stability, and process versatility. Titanium films serve as adhesion layers, diffusion barriers, and functional coatings across semiconductor manufacturing, optical systems, and advanced industrial applications. Owing to its stable sputtering behavior and broad compatibility with reactive processes, titanium remains a cornerstone material in thin-film engineering.

Detailed Description

Titanium sputtering targets are manufactured from high-purity titanium using vacuum melting, forging, and precision machining to achieve a uniform grain structure and low impurity content. These characteristics are essential for minimizing particle generation, stabilizing plasma conditions, and ensuring consistent deposition rates during sputtering.

Titanium is conductive and well suited for DC magnetron sputtering, while also performing reliably in reactive sputtering environments with gases such as oxygen or nitrogen to form TiO₂, TiN, or TiOxNy films. Titanium thin films exhibit strong adhesion to substrates including silicon, glass, ceramics, and polymers, making Ti an ideal interlayer material in complex multilayer stacks.

Targets can be supplied as monolithic discs or bonded to copper or titanium backing plates to improve heat dissipation and mechanical stability under high power densities. Tight dimensional tolerances and surface finish control ensure compatibility with standard sputtering cathodes and long service life.

Applications

Titanium sputtering targets are widely used in:

  • Semiconductor fabrication: Adhesion layers, diffusion barriers, and interconnect stacks

  • Optical coatings: Adhesion and functional metal layers

  • Decorative coatings: Metallic finishes and base layers

  • Hard coatings: Precursors for TiN and TiCN via reactive sputtering

  • Medical devices: Biocompatible thin films

  • Research & development: Thin-film materials studies and process optimization

Technical Parameters

ParameterTypical Value / RangeImportance
MaterialTitanium (Ti)Determines adhesion and reactivity
Purity99.9% – 99.995%Reduces contamination and defects
Diameter25 – 300 mm (custom)Fits standard sputtering cathodes
Thickness3 – 12 mm (typical)Influences target lifetime
Density≥ 99% of theoreticalEnsures stable sputtering
Sputtering ModeDC / Reactive DCSuitable for metallic targets
Backing PlateCu / Ti (optional)Improves thermal management

Comparison with Related Metal Targets

MaterialKey AdvantageTypical Application
Titanium (Ti)Excellent adhesion, reactive flexibilityAdhesion & barrier layers
Chromium (Cr)Strong adhesion, harder filmsOptical underlayers
Tantalum (Ta)High temperature stabilityAdvanced barriers
Aluminum (Al)High conductivity, low costMetallization layers

FAQ

QuestionAnswer
Can titanium targets be customized?Yes, size, purity, thickness, and bonding options are available.
Is titanium suitable for reactive sputtering?Yes, Ti is widely used to form TiO₂, TiN, and related compounds.
Which sputtering mode is recommended?DC magnetron sputtering is typically used due to titanium’s conductivity.
How are titanium targets packaged?Vacuum-sealed with protective cushioning to prevent contamination and oxidation.

Packaging

Our Titanium Sputtering Targets (Ti) are meticulously tagged and labeled for traceability and quality control. Each target is vacuum-sealed and protected with reinforced cushioning to ensure safe storage and damage-free transportation.

Conclusion

Titanium Sputtering Targets (Ti) provide a reliable and highly versatile solution for depositing metallic and compound thin films across a wide range of industries. With excellent adhesion performance, stable sputtering behavior, and flexible customization options, titanium targets are well suited for both high-volume manufacturing and advanced research applications.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

Order Now

Ti target 4n5 ø200*6mm, Ti Target 4N ø76.2×5mm, Ti target 4N ø101.6×6.35mm with Keeper, Ti target 4N Density>97% ø76.2×6.35mm, Ti target ø4"×6mm 4N

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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