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Titanium Sputtering Target

ST0053 Titanium Sputtering Target, Ti

Chemical Formula: Ti
Catalog Number: ST0053
CAS Number: 7440-32-6
Purity: 99.2%-99.7%, 99.97%-99.98%, >99.99%, 99.995%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Titanium sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Titanium Sputtering Target Description

TitaniumThe titanium sputtering target, made from high-purity titanium metal, is utilized in various applications due to its exceptional properties. Titanium, a Group IV transition metal, is renowned for its biocompatibility, low density, high strength, and excellent corrosion resistance, particularly in seawater, aqua regia, and chlorine. These characteristics make it ideal for ocean liner hulls, aircraft engines, and designer jewelry. Titanium sputtering targets are widely used for CD-ROM production, decorative coatings, flat panel displays, functional coatings, optical information storage, glass coatings for automotive and architectural glass, and optical communications.

Titanium Sputtering Target Specification

Material TypeTitanium
SymbolTi
Color/AppearanceSilvery Metallic
Melting Point 1,660°C
Theoretical Density 4.5(g/cc)
SputterDC
CommentsAlloys with W/Ta/Mo; evolves gas on first heating.
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Titanium Sputtering Target Application

High-performance titanium sputtering materials are essential for thin film coating applications, including CD-ROM production, decorative coatings, flat panel displays, functional coatings, optical information storage, glass coatings for automotive and architectural glass, and optical communications.

Chemical Plants

Titanium’s high corrosion resistance makes it ideal for chemical equipment. Approximately 30% of domestically used titanium is employed in chemical plants.

Seawater Usage

Titanium is extensively used in nuclear and fossil power stations, particularly in large heat exchangers and condensers that cool steam from turbines with seawater. Due to its non-corrosive nature, the condenser tubes can have wall thicknesses as thin as 0.5 mm, consuming about 20% of domestic titanium.

Daily Life Applications

Titanium is increasingly found in everyday items, including sports equipment, building materials, medical applications, and accessories, accounting for about 30% of domestic consumption.

Aerospace

In the USA, around 70% of titanium production is dedicated to aerospace parts. In contrast, only 2-3% of titanium in Japan is used for aerospace, highlighting a significant market structure difference between the two countries.

Planar and Rotary Titanium Sputtering Target

Our planar titanium sputtering targets boast high purity and density, along with a uniform microstructure, making them ideal for depositing thin films in TFT displays and related industries. We offer both single and multi-piece titanium planar targets.

Our rotary titanium sputtering targets feature a high utilization rate of over 75%, ensuring efficient use of target materials.

Titanium Target Bonding Service

Specialized bonding services for Titanium Sputtering Targets, including indium and elastomeric bonding techniques, enhance performance and durability. Thin Film Materials (TFM) ensures high-quality solutions that meet industry standards and customer needs.

We also offer custom machining of backing plates, which is essential for sputtering target assembly. This comprehensive approach improves target design flexibility and performance in thin film deposition. Our channels provide detailed information about bonding materials, methods, and services, helping clients make informed decisions.

Titanium Sputtering Target Packaging

Our titanium sputtering targets are meticulously handled to prevent damage during storage and transportation, ensuring they maintain their original high quality.

Get Contact

TFM offers Titanium Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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