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ST0519 Tungsten Boride Sputtering Target, WB

Chemical Formula: WB
Catalog Number: ST0519
CAS Number: 12007-09-9
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Tungsten Boride sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Tungsten Boride Sputtering Target Description

TungstenTungsten is a rare metal that occurs naturally on Earth, predominantly in combination with other elements in chemical compounds rather than in its pure form. Discovered as a new element in 1781 and first isolated as a metal in 1783, tungsten’s primary ores include wolframite and scheelite.

Tungsten boasts the highest melting point of any element, melting at an impressive 3422 °C, and also holds the record for the highest boiling point at 5930 °C. With a density 19.25 times that of water, tungsten is comparable to uranium and gold, and significantly denser than lead by about 1.7 times. While polycrystalline tungsten is naturally brittle and hard, making it challenging to work with, pure single-crystalline tungsten is more ductile, allowing it to be cut with a hard-steel hacksaw.

Related Product: Tungsten Sputtering Target.

Tungsten Boride Sputtering Target Specifications

Material TypeTungsten Boride
SymbolWB
Color/AppearanceSolid
Melting Point/
Density15.3 g/cm3
Available SizesDia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Tungsten Boride Sputtering Target Applications

Hard Coatings: WB sputtering targets are essential for applying hard coatings to cutting tools, drill bits, and wear-resistant components in industries like metalworking and machining. These coatings significantly enhance tool durability and performance by increasing hardness and wear resistance.

Aerospace and Defense: WB thin films are vital in aerospace and defense, where they protect critical components in aircraft and rocket engines—such as turbine blades and nozzles—from high temperatures and extreme conditions, ensuring reliability and longevity in demanding environments.

Electronics: In semiconductor manufacturing, WB is used to create thin-film resistors and integrated circuits (ICs) due to its unique electrical properties. These films contribute to the miniaturization and performance enhancement of electronic devices.

Optical Coatings: Tungsten boride coatings are applied to optical lenses, mirrors, and other components to improve durability, enhance reflectivity, reduce glare, and extend the lifespan of optical elements, making them indispensable in optical systems and devices.

Energy Storage: WB is increasingly explored for advanced energy storage systems, including lithium-ion batteries and supercapacitors. Its excellent thermal stability and electrical conductivity make it a promising material for enhancing the energy storage and conversion capabilities of these technologies, which are crucial for the renewable energy sector and electric vehicles.

Packing

Our Tungsten Boride Sputtering Targets are clearly tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to avoid any damage during storage or transportation.

 

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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