Product Overview
Tungsten Carbide Sputtering Target (WC) is a compound sputtering target used to deposit thin films where a specific pre-compounded chemistry is required. These materials can behave differently from conductive metallic targets in terms of electrical response, thermal shock resistance, density sensitivity, and cracking risk, so target dimensions, density, backing design, and sputtering mode should be considered together.
Material and Deposition Characteristics
The appropriate sputtering mode depends on target conductivity, thermal behavior, and the power-supply configuration. Many compound ceramic targets are evaluated first with RF magnetron sputtering, especially when electrical resistivity is high. For brittle or low-thermal-conductivity materials, density, backing support, and stable cooling are important for reliable operation.
Technical Data
| Parameter | Typical Value / Range | Importance |
|---|---|---|
| Chemical Formula | WC | Defines carbide composition |
| Purity | 99.5% – 99.99% | Minimizes impurity phases |
| Density | ≥ 99% theoretical density | Ensures stable sputtering rate |
| Diameter | 1″ – 8″ (custom available) | Matches cathode systems |
| Thickness | 3 – 10 mm | Influences lifetime |
| Bonding | Cu backing plate optional | Improves heat transfer |
| Sputtering Method | DC magnetron preferred | Suitable for conductive carbides |
| Material | Key Advantage | Typical Application |
|---|---|---|
| Tungsten Carbide (WC) | Extremely high hardness & wear resistance | Tool coatings |
| Titanium Carbide (TiC) | Lower density, good hardness | Protective films |
| Chromium Carbide (Cr₃C₂) | Oxidation resistance at elevated temps | High-temperature coatings |
| Pure Tungsten (W) | High melting point, ductile metal | Barrier layers |
| Question | Answer |
|---|---|
| Is WC suitable for DC sputtering? | Yes, WC’s electrical conductivity makes it compatible with DC magnetron sputtering. |
| Can the carbon content be customized? | Yes, stoichiometry can be adjusted based on film performance requirements. |
| Is bonding recommended? | For large-diameter or high-power applications, copper backing plates improve stability. |
| Are rotary targets available? | Yes, rotary configurations can be supplied for industrial coating lines. |
| How is the target packaged? | Vacuum-sealed with protective cushioning and export-grade cartons or wooden crates. |
Typical Thin-Film Applications
- Compound thin films for semiconductor, optical, protective, hard-coating, and functional-material research
- Applications where a pre-compounded target is preferred over co-sputtering separate elemental targets
- Projects requiring controlled chemistry and tailored target geometry for PVD development
Target Configuration and Ordering Considerations
When requesting a quotation, provide target diameter or rectangular dimensions, thickness, purity or composition, required quantity, and whether a backing plate or bonded assembly is needed. For brittle ceramic or compound targets, it is useful to specify the cathode model, backing-plate material, preferred bonding method, operating power if known, and any density, tolerance, or inspection-document requirements. TFM can review drawings, old-target photos, and application details when custom dimensions are required.
Frequently Asked Questions
What is the main reason to use a Tungsten Carbide sputtering target?
It provides a composition-specific source for depositing thin films when the required chemistry is better introduced from a pre-compounded target than from co-sputtering separate elements.
How should the sputtering mode for Tungsten Carbide be selected?
The power mode should be selected from target conductivity, thermal behavior, and equipment capability. Many compound ceramic targets are first evaluated with RF magnetron sputtering.
Why are density and microstructure important for Tungsten Carbide targets?
Uniform density and microstructure help support stable erosion and thermal behavior, while pores or local defects can increase the risk of cracking, particles, or unstable plasma.
Can a Tungsten Carbide target be supplied with a backing plate?
Yes. Where the material is brittle or the cathode requires a backing assembly, bonded configurations can be reviewed according to target size, thickness, cooling, and operating power.
Does target composition always equal film composition?
No. Film chemistry can shift because of different sputtering yields, reactive conditions, substrate temperature, re-sputtering, or chamber history. Verify the film when the chemistry is critical.
What should I provide to request a quotation for Tungsten Carbide?
Please provide material composition, purity, dimensions, quantity, target or backing configuration, cathode model or system details, and any drawing, tolerance, or inspection requirements.
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