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VD0808 Tungsten Disilicide Evaporation Materials, WSi2

Catalog No.VD0808
MaterialTungsten Silicide (WSi2)
Purity99.5%
ShapePowder/ Granule/ Custom-made

TFM stands out as a top-tier manufacturer and supplier specializing in high-purity tungsten disilicide for evaporation applications. Our extensive range of evaporation materials is available in both powder and granule forms. Additionally, we offer customized solutions to meet specific requirements upon request.

MSDS File

Tungsten Disilicide Evaporation Materials Overview

Tungsten disilicide (WSi₂) is a silicide ceramic material renowned for its role in high-precision deposition processes. TFM specializes in manufacturing tungsten disilicide evaporation materials with exceptional purity levels, up to 99.9995%. These materials are crucial for achieving high-quality deposited films and are produced under stringent quality assurance measures to ensure reliability.

Specifications of Tungsten Disilicide Evaporation Materials

Material TypeTungsten disilicide
SymbolWSi2
Appearance/ColorBlue-gray tetragonal crystals
Melting Point2,160 °C (3,920 °F; 2,430 K)
Density9.3 g/cm3
Purity99.5%
ShapePowder/ Granule/ Custom-made

Applications of Tungsten Disilicide Evaporation Materials

Tungsten disilicide evaporation materials are integral to various deposition techniques, including:

  • Semiconductor deposition
  • Chemical vapor deposition (CVD)
  • Physical vapor deposition (PVD)

These materials are primarily used for optical applications such as wear protection, decorative coatings, and displays.

Packaging and Handling

Our tungsten disilicide materials are meticulously tagged and labeled to facilitate efficient identification and quality control. We prioritize careful packaging to prevent damage during storage and transportation.

Contact TFM

TFM is a premier provider of high-purity tungsten disilicide evaporation materials. We offer various shapes, including tablets, granules, rods, and wires, with custom options available upon request. In addition to evaporation materials, we supply evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and inquiries about materials not listed, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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