Product Overview
Tungsten Silicide Sputtering Target (WSi2) is a compound sputtering target used to deposit thin films where a specific pre-compounded chemistry is required. These materials can behave differently from conductive metallic targets in terms of electrical response, thermal shock resistance, density sensitivity, and cracking risk, so target dimensions, density, backing design, and sputtering mode should be considered together.
Material and Deposition Characteristics
The appropriate sputtering mode depends on target conductivity, thermal behavior, and the power-supply configuration. Many compound ceramic targets are evaluated first with RF magnetron sputtering, especially when electrical resistivity is high. For brittle or low-thermal-conductivity materials, density, backing support, and stable cooling are important for reliable operation.
Technical Data
| Parameter | Typical Value / Range | Importance |
|---|---|---|
| Chemical Formula | WSi₂ | Defines silicide film composition |
| Purity | 99.9% – 99.99% | Ensures electrical and structural consistency |
| Atomic Ratio | W : Si ≈ 1 : 2 | Controls film resistivity and phase stability |
| Diameter | 25 – 300 mm (custom) | Compatible with standard sputtering cathodes |
| Thickness | 3 – 6 mm (typical) | Influences sputtering lifetime |
| Density | ≥ 98% of theoretical | Supports uniform sputtering behavior |
| Backing Plate | Cu / Mo (optional) | Improves thermal management |
| Material | Key Advantage | Typical Application |
|---|---|---|
| Tungsten Silicide (WSi₂) | Low resistivity, high thermal stability | Semiconductor gate & interconnects |
| Tungsten (W) | Extremely high melting point | Barrier and contact layers |
| Titanium Silicide (TiSi₂) | Very low resistivity | CMOS interconnects |
| Question | Answer |
|---|---|
| Why choose WSi₂ instead of pure tungsten? | WSi₂ offers lower resistivity and better compatibility with silicon devices. |
| Is RF or DC sputtering used for WSi₂? | Both RF and DC sputtering are possible, depending on system design. |
| Can WSi₂ targets be bonded? | Yes, copper or molybdenum backing plates are available. |
| Are custom compositions available? | Custom silicide ratios can be discussed for specific applications. |
| How are the targets packaged? | Vacuum-sealed with moisture and impact protection. |
Typical Thin-Film Applications
- Compound thin films for semiconductor, optical, protective, hard-coating, and functional-material research
- Applications where a pre-compounded target is preferred over co-sputtering separate elemental targets
- Projects requiring controlled chemistry and tailored target geometry for PVD development
Target Configuration and Ordering Considerations
When requesting a quotation, provide target diameter or rectangular dimensions, thickness, purity or composition, required quantity, and whether a backing plate or bonded assembly is needed. For brittle ceramic or compound targets, it is useful to specify the cathode model, backing-plate material, preferred bonding method, operating power if known, and any density, tolerance, or inspection-document requirements. TFM can review drawings, old-target photos, and application details when custom dimensions are required.
Frequently Asked Questions
What is the main reason to use a Tungsten Silicide sputtering target?
It provides a composition-specific source for depositing thin films when the required chemistry is better introduced from a pre-compounded target than from co-sputtering separate elements.
How should the sputtering mode for Tungsten Silicide be selected?
The power mode should be selected from target conductivity, thermal behavior, and equipment capability. Many compound ceramic targets are first evaluated with RF magnetron sputtering.
Why are density and microstructure important for Tungsten Silicide targets?
Uniform density and microstructure help support stable erosion and thermal behavior, while pores or local defects can increase the risk of cracking, particles, or unstable plasma.
Can a Tungsten Silicide target be supplied with a backing plate?
Yes. Where the material is brittle or the cathode requires a backing assembly, bonded configurations can be reviewed according to target size, thickness, cooling, and operating power.
Does target composition always equal film composition?
No. Film chemistry can shift because of different sputtering yields, reactive conditions, substrate temperature, re-sputtering, or chamber history. Verify the film when the chemistry is critical.
What should I provide to request a quotation for Tungsten Silicide?
Please provide material composition, purity, dimensions, quantity, target or backing configuration, cathode model or system details, and any drawing, tolerance, or inspection requirements.
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