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Tungsten Sputtering Target

ST0054 Tungsten Sputtering Target, W

Chemical Formula: W
Catalog Number: ST0054
CAS Number: 7440-33-7
Purity: 99.9%, 99.95%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

TFM offers Tungsten Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

MSDS File

Tungsten Sputtering Target Description

Tungsten

Tungsten sputtering targets are crafted from high-purity tungsten metal. Tungsten, also known as wolfram, is a rare metal that naturally occurs almost exclusively in chemical compounds. Discovered in 1781 and isolated as a metal by 1783, tungsten’s significant ores include wolframite and scheelite.

Unmatched Physical Properties

  • Highest Melting Point: Tungsten has the highest melting point of all elements at 3422 °C, making it ideal for use in extreme temperatures.
  • Extraordinary Boiling Point: With a boiling point of 5930 °C, tungsten targets are excellent for high-performance applications.
  • Exceptional Density: Tungsten has a density comparable to uranium and gold, being 19.25 times that of water, which suits applications requiring a heavy mass in a small volume.
  • Intrinsic Hardness: While polycrystalline tungsten is inherently hard and brittle, our single-crystalline tungsten targets offer enhanced ductility, making them suitable for various industrial processes.
tungsten_sputtering_target_microstructure
The Microstructure of Tungsten Sputtering Target

Tungsten Sputtering Target Specifications

Material TypeTungsten
SymbolW
Color/AppearanceGrayish White, Lustrous, Metallic
Melting Point3422°C
Density19.3 g/cm3
SputterDC
Type of BondIndium, Elastomer
CommentsForms volatile oxides. Films hard and adherent.
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Tungsten Sputtering Target Application

Our tungsten sputtering targets deliver superior thin-film coatings for diverse applications, including:

  • Electronics: Perfect for the fabrication of semiconductors, providing higher data storage and processing capabilities.
  • Industry and Tools: Essential in producing robust cutting tools and machinery components, leveraging tungsten’s high density and hardness.
  • Decorative Finishes: Ideal for applications requiring durable decorative coatings due to its reflective metallic sheen.

Enhanced Services

  • Shape Versatility: We offer a wide selection of shapes, including discs, plates, column targets, and step targets, customized to your specifications.
  • Bonding Services: Indium bonding and elastomeric target bonding services are available to enhance the utility and longevity of our targets.
  • Ease of Access: Safety data sheets with comprehensive handling information are available to ensure safe and efficient use.

Tungsten Sputtering Target Packing

Tungsten sputter targets from TFM are tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to prevent any damage during storage and transportation, preserving the quality and integrity of our products.

Frequently Asked Questions (FAQs)

Q1: What are the benefits of using tungsten sputtering targets in industrial applications?
A1: Tungsten targets offer exceptional thermal and electrical conductivities, making them crucial for applications that require extreme temperature resistance and durability.

Q2: Can I order tungsten sputtering targets in custom dimensions?
A2: Yes, we provide targets in various shapes and sizes, tailored to meet specific application needs.

Q3: How do you ensure the quality of your tungsten targets?
A3: Each target undergoes rigorous quality control processes to maintain high purity and structural integrity.

Q4: What kind of support services do you offer for tungsten targets?
A4: We offer comprehensive bonding services and detailed technical support to ensure optimal performance and ease of use.

Why Choose Our Tungsten Targets?

  • Purity Guaranteed: We ensure a 99.95% purity level, meticulously verified to deliver optimal performance.
  • Quality Assurance: Rely on the testimonies of our satisfied clients who have enhanced their productivity using our products.

Get Contact

TFM offers Tungsten Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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